
www.ti.com29-Jun-2011 PACKAGING INFORMATION
Orderable Device Status (1)Package Type Package
Drawing Pins Package Qty Eco Plan (2)Lead/
Ball Finish
MSL Peak Temp (3)Samples
(Requires Login)
TLC5510AINS ACTIVE SO NS2434Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLC5510AINSG4ACTIVE SO NS2434Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM TLC5510AINSLE OBSOLETE SO NS24TBD Call TI Call TI
TLC5510AINSR ACTIVE SO NS242000Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLC5510AINSRG4ACTIVE SO NS242000Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM TLC5510INSLE OBSOLETE SO NS24TBD Call TI Call TI
TLC5510INSR ACTIVE SO NS242000Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLC5510INSRG4ACTIVE SO NS242000Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLC5510IPW ACTIVE TSSOP PW2460Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
TLC5510IPWG4ACTIVE TSSOP PW2460Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
TLC5510IPWR ACTIVE TSSOP PW242000Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
TLC5510IPWRG4ACTIVE TSSOP PW242000Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
www.ti.com29-Jun-2011 Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL
INFORMATION *All
dimensions are nominal Device Package Type Package Drawing
Pins
SPQ Reel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant TLC5510AINSR SO
NS 242000330.024.48.215.4 2.512.024.0Q1TLC5510INSR SO
NS 242000330.024.48.215.4 2.512.024.0Q1TLC5510IPWR TSSOP PW 242000
330.016.4 6.958.3 1.68.016.0Q1www.ti.com 28-Jun-2011
*All
dimensions are nominal Device
Package Type Package Drawing Pins SPQ Length (mm)Width (mm)Height (mm)TLC5510AINSR
SO NS 242000346.0346.041.0TLC5510INSR
SO NS 242000346.0346.041.0TLC5510IPWR TSSOP PW 242000346.0346.033.0
www.ti.com 28-Jun-2011
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