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tlc5510

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tlc5510

www.ti.com29-Jun-2011PACKAGINGINFORMATIONOrderableDeviceStatus(1)PackageTypePackageDrawingPinsPackageQtyEcoPlan(2)Lead/BallFinishMSLPeakTemp(3)Samples(RequiresLogin)TLC5510AINSACTIVESONS2434Green(RoHS&noSb/Br)CUNIPDAULevel-1-260C-UNLIMTLC5510AINSG4A
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导读www.ti.com29-Jun-2011PACKAGINGINFORMATIONOrderableDeviceStatus(1)PackageTypePackageDrawingPinsPackageQtyEcoPlan(2)Lead/BallFinishMSLPeakTemp(3)Samples(RequiresLogin)TLC5510AINSACTIVESONS2434Green(RoHS&noSb/Br)CUNIPDAULevel-1-260C-UNLIMTLC5510AINSG4A


www.ti.com29-Jun-2011 PACKAGING INFORMATION

Orderable Device Status (1)Package Type Package

Drawing Pins Package Qty Eco Plan (2)Lead/

Ball Finish

MSL Peak Temp (3)Samples

(Requires Login)

TLC5510AINS ACTIVE SO NS2434Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

TLC5510AINSG4ACTIVE SO NS2434Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM TLC5510AINSLE OBSOLETE SO NS24TBD Call TI Call TI

TLC5510AINSR ACTIVE SO NS242000Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

TLC5510AINSRG4ACTIVE SO NS242000Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM TLC5510INSLE OBSOLETE SO NS24TBD Call TI Call TI

TLC5510INSR ACTIVE SO NS242000Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

TLC5510INSRG4ACTIVE SO NS242000Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

TLC5510IPW ACTIVE TSSOP PW2460Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR

TLC5510IPWG4ACTIVE TSSOP PW2460Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR

TLC5510IPWR ACTIVE TSSOP PW242000Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR

TLC5510IPWRG4ACTIVE TSSOP PW242000Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

www.ti.com29-Jun-2011 Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL

INFORMATION *All

dimensions are nominal Device Package Type Package Drawing

Pins

SPQ Reel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant TLC5510AINSR SO

NS 242000330.024.48.215.4 2.512.024.0Q1TLC5510INSR SO

NS 242000330.024.48.215.4 2.512.024.0Q1TLC5510IPWR TSSOP PW 242000

330.016.4 6.958.3 1.68.016.0Q1www.ti.com 28-Jun-2011

*All

dimensions are nominal Device

Package Type Package Drawing Pins SPQ Length (mm)Width (mm)Height (mm)TLC5510AINSR

SO NS 242000346.0346.041.0TLC5510INSR

SO NS 242000346.0346.041.0TLC5510IPWR TSSOP PW 242000346.0346.033.0

www.ti.com 28-Jun-2011

Texas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are used.Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.

Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Information of third parties may be subject to additional restrictions.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.

TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.

TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.

Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products Applications

Audio www.ti.com/audio Communications and Telecom www.ti.com/communications

Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers

Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps

DLP®Products www.dlp.com Energy and Lighting www.ti.com/energy

DSP dsp.ti.com Industrial www.ti.com/industrial

Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical

Interface interface.ti.com Security www.ti.com/security

Logic logic.ti.com Space,Avionics and Defense www.ti.com/space-avionics-defense Power Mgmt power.ti.com Transportation and www.ti.com/automotive

Automotive

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com Wireless www.ti.com/wireless-apps

RF/IF and ZigBee®Solutions www.ti.com/lprf

TI E2E Community Home Page e2e.ti.com

Mailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265

Copyright©2011,Texas Instruments Incorporated

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tlc5510

www.ti.com29-Jun-2011PACKAGINGINFORMATIONOrderableDeviceStatus(1)PackageTypePackageDrawingPinsPackageQtyEcoPlan(2)Lead/BallFinishMSLPeakTemp(3)Samples(RequiresLogin)TLC5510AINSACTIVESONS2434Green(RoHS&noSb/Br)CUNIPDAULevel-1-260C-UNLIMTLC5510AINSG4A
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