Handling,Packing, Shipping and Use of
Moisture/Reflow
Sensitive Surface
Mount Devices IPC/JEDEC J-STD-033C February2012 Supersedes IPC/JEDEC J-STD-033B Includes Amemdment1
October2005Notice JEDEC and IPC Standards and Publications are designed to serve the public
interest through eliminating misunderstandings between manufacturers and
purchasers,facilitating interchangeability and improvement of products,
and assisting the purchaser in selecting and obtaining with minimum delay
the proper product for his particular need.Existence of such Standards and
Publications shall not in any respect preclude any member or nonmember
of JEDEC or IPC from manufacturing or selling products not conforming
to such Standards and Publications,nor shall the existence of such Standards
and Publications preclude their voluntary use by those other than JEDEC
and IPC members,whether the standard is to be used either domestically
or internationally.
Recommended Standards and Publications are adopted by JEDEC and
IPC without regard to whether their adoption may involve patents on articles,
materials,or processes.By such action,JEDEC and IPC do not assume any
liability to any patent owner,nor do they assume any obligation whatever
to parties adopting the Recommended Standard or Publication.Users are also
wholly responsible for protecting themselves against all claims of liabilities
for patent infringement.
The material in this joint standard was developed by the JEDEC JC-14.1
Committee on Reliability Test Methods for Packaged Devices and the IPC
Plastic Chip Carrier Cracking Task Group(B-10a)
For Technical Information Contact:
JEDEC
Solid State Technology Association 3103North10th Street,Suite240-S Arlington,V A22201-2107
Tel703907.0026
Fax703907.7501IPC
3000Lakeside Drive,Suite309S Bannockburn,Illinois
60015-1249
Tel847615.7100
Fax847615.7105
Please use the Standard Improvement Form shown at the end of this
document.
©Copyright2012.JEDEC Solid State Technology Association,Arlington,Virginia,and IPC,Bannockburn,Illinois,USA.All rights reserved under both international and Pan-American copyright conventions.Any copying,scanning or other reproduction of these materials without the prior written consent of the copyright holder is strictly prohibited and constitutes infringement under the Copyright Law of the United States.IPC/JEDEC J-STD-033C
Handling,Packing, Shipping and Use of Moisture/Reflow Sensitive Surface
Mount Devices
A joint standard developed by the JEDEC JC-14.1Committee on Reliability Test Methods for Packaged Devices and the B-10a Plastic Chip Carrier Cracking Task Group of IPC
Users of this standard are encouraged to participate in the development of future revisions.
Contact:
JEDEC
Solid State Technology Association 3103North10th Street,Suite240-S Arlington,V A22201-2107
Tel703907.0026
Fax703907.7501IPC
3000Lakeside Drive,Suite309S Bannockburn,Illinois
60015-1249
Tel847615.7100
Fax847615.7105
Supersedes:
IPC/JEDEC J-STD-033B.1 includes Amendment1-January2007
IPC/JEDEC J-STD-033B-October2005
IPC/JEDEC J-STD-033A-July2002
IPC/JEDEC J-STD-033-
April1999
JEDEC JEP124
IPC-SM-786A-January1995 IPC-SM-786-December1990
®This Page Intentionally Left Blank
Acknowledgment
Members of the Joint IPC/JEDEC Moisture Classification Task Group have worked to develop this document.We would like to thank them for their dedication to this effort.Any standard involving a complex technology draws material from a vast number of sources.While the principal members of the Joint Moisture Classification Working Group are shown below, it is not possible to include all of those who assisted in the evolution of this Standard.To each of them,the members of the JEDEC and IPC extend their gratitude.
IPC Plastic Chip Carrier Cracking Task Group,B-10a Chairman
Steven Martell
Sonoscan,Inc.JEDEC JC14.1
Committee
Chairman
Jack McCullen
Intel Corporation
JEDEC JC14
Chairman
Nick Lycoudes
Freescale Semiconductor
Joint Working Group Members
Doug Derry,AccuAssembly
Ranjit Gannamani,Advanced Micro Devices
Joseph Smetana,Alcatel-Lucent Russell Nowland,Alcatel-Lucent Bradley Smith,Allegro MicroSystems Inc.
Maurice Brodeur,Analog Devices Inc.
Bill Strachan,ASTA-Portsmouth University
Lyle Burhenn,BAE Systems Platform Solutions
Mary Bellon,Boeing Research& Development
Tim Chaudhry,Broadcom Corporation
Glenn Koscal,Carsem
Kevin Weston,Celestica
Jasbir Bath,Christopher Associates Inc.
Francois Monette,Cogiscan Inc. Erich Goertler,Continental Automotive GmbH
Michael Blazier,Delphi Electronics and Safety
Michael Pepples,Delphi Electronics and Safety
Stuart Longgood,Delphi Electronics and Safety
David Gaydos,DLG Technical Engineering
Joanne Shipe,DSM Engineering Plastics
Ralph Justus,EIA-Electronic Industries Alliance
Glenn Dearing,Endicott Interconnect Technologies Inc Dongkai Shangguan,Flextronics
International
Nicholas Lycoudes,Freescale
Semiconductor
Deepak Pai,General Dynamics Info.
Sys.,Inc
Gergely Csohany,Harman/Becker
Automotive Systems Kft.
Srinivas Chada,Henkel Corporation
Keith Newman,Hewlett-Packard
Company
Jennie Hwang,H-Technologies
Group
Charles Reynolds,IBM Corporation
Mario Interrante,IBM Corporation
Paul Krystek,IBM Corporation
Curtis Grosskopf,IBM Corporation
James Maguire,Intel Corporation
Jack McCullen,Intel Corporation
Mark Kwoka,Intersil Corporation
Kerry Oren,ITT
Quyen Chu,Jabil Circuit,Inc.
Marty Rodriguez,Jabil Circuit,Inc.
(HQ)
Girish Wable,Jabil Circuit,Inc.(HQ)
Julie Carlson,JEDEC
Ken McGhee,JEDEC
Akikazu Shibata,JPCA-Japan
Electronics Packaging and Circuits
Association
Leland Woodall,Keihin Carolina
System Technology
Leo Feinstein,Leo Feinstein
Associates
James Mark Bird,MBird and
Associates
Kurk Kan,Murata Power Solutions,
Inc.
Paul Melville,NXP Semiconductors
John Burke,Optichron Inc.
Heidi Reynolds,Oracle America,Inc.
Mumtaz Bora,Peregrine
Semiconductor
Arnold Offner,Phoenix Contact
Timothy Pitsch,Plexus Corporation
Elvira Preecha,Qualcomm Inc.
Richard Iodice,Raytheon Company
James Robbins,Raytheon Company
Jeff Shubrooks,Raytheon Company
Christian Klein,Robert Bosch GmbH
Scott Anson,Rochester Institute of
Technology
Michelle Ogihara,Seika Machinery
Inc.
Francis Classe,Spansion
Brent Beamer,Static Control
Components,Inc.
Raymond Cirimele,STI Electronics,
Inc.
Christine Blair,STMicroelectronics
Inc.
Amol Kirtikar,Sud-Chemie Inc.
Performance Packaging
Michelle Martin,Sud-Chemie
Performance Package
Robert DiMaggio,Sud-Chemie
Performance Package
Larry Nye,Texas Instruments Inc.
Joseph Thomas,ZN Technologies
James Whitehouse
February2012IPC/JEDEC J-STD-033C
iiiIPC/JEDEC J-STD-033C February2012
This Page Intentionally Left Blank
iv
Table of Contents
1FOREWORD (1)
1.1Purpose (1)
1.2Scope (1)
1.3Assembly Processes (1)
1.3.1Mass Reflow (1)
1.3.2Localized Heating (1)
1.3.3Socketed Components (1)
1.3.4Point-to-Point Soldering (1)
1.3.5Aqueous Cleaning (1)
1.4Reliability (2)
1.5Terms and Definitions (2)
1.5.1Active Desiccant (2)
1.5.2Bar Code Label (2)
1.5.3Bulk Reflow (2)
1.5.4Carrier (2)
1.5.5Desiccant (2)
1.5.6Floor Life (2)
1.5.7Humidity Indicator Card(HIC) (2)
1.5.8Manufacturer’s Exposure Time(MET) (2)
1.5.9Moisture-Barrier Bag(MBB) (2)
1.5.10Moisture-Sensitive Identification(MSID) (2)
1.5.11Rework (2)
1.5.12Shelf Life (2)
1.5.13SMD (2)
1.5.14Solder Reflow (2)
1.5.15Water Vapor Transmission Rate(WVTR) (3)
2APPLICABLE DOCUMENTS(Normative) (3)
2.1American Society for Testing and Materials
(ASTM) (3)
2.2Electronic Industries Alliance(EIA,JEDEC) (3)
2.3IPC Standards (3)
2.4Joint Industry Standards (3)
2.5Department of Defense (3)
3DRY PACKING (3)
3.1Requirements (3)
3.2Drying of SMD Packages and Carrier
Materials Before Being Sealed in MBBs (3)
3.2.1Drying Requirements-Levels2a-5a (3)
3.2.2Drying Requirements for Carrier Materials (4)
3.2.3Drying Requirements (4)
3.2.4Excess Time Between Bake and Bag (4)
3.3Dry Pack (4)
3.3.1Description...........................................................43.3.2Materials (4)
3.3.3Labels (6)
3.3.4Moisture Barrier Bag Sealing (6)
3.3.5Dry-Pack Precautions (6)
3.3.6Shelf Life (7)
4DRYING (7)
4.1Post Exposure to Factory Ambient (7)
4.1.1Any Duration Exposure (7)
4.1.2Short Duration Exposure (10)
4.2General Considerations for Baking (10)
4.2.1High Temperature Carriers (10)
4.2.2Low Temperature Carriers (10)
4.2.3Paper and Plastic Container Items (10)
4.2.4Bakeout Times (10)
4.2.5ESD Protection (10)
4.2.6Reuse of Carriers (10)
4.2.7Solderability Limitations (10)
5USE (11)
5.1Incoming Bag Inspection (11)
5.1.1Upon Receipt (11)
5.1.2Component Inspection (11)
5.2Floor Life (11)
5.3Safe Storage (11)
5.3.1Dry Pack (11)
5.3.2Shelf Life (11)
5.3.3Dry Atmosphere Cabinet (11)
5.4Reflow (12)
5.4.1Opened MBB (12)
5.4.2Reflow Temperature Extremes (12)
5.4.3Additional Thermal Profile Parameters (12)
5.4.4Multiple Reflow Passes (12)
5.4.5Maximum Reflow Passes (12)
5.5Drying Indicators (12)
5.5.1Excess Humidity in the Dry Pack (12)
5.5.2Floor Life or Ambient Temperature/
Humidity Exceeded (13)
5.5.3Level6SMD Packages (13)
6BOARD REWORK (13)
6.1Component Removal,Rework,and Remount..13 6.1.1Removal for Failure Analysis (13)
6.1.2Removal and Remount (13)
6.2Baking of Populated Boards (13)
v7DERATING DUE TO FACTORY
ENVIRONMENTAL CONDITIONS (13)
APPENDIX A Test Method for Humidity
Indicator Card used with
Electronic Component
Packaging (15)
APPENDIX B Derivation of Bake Tables (16)
APPENDIX C Changes in J-STD-033C (17)
Figures
Figure3-1Typical Dry-Pack Configuration for Moisture-
Sensitive SMD Packages in Shipping Tubes (4)
Figure3-2Humidity Indicator Card(HIC)(Example) (5)
Figure3-3Moisture-Sensitive Identification Label
(Example) (6)
Figure3-4Moisture-Sensitive Caution Label(Example) (6)
Figure3-5MBB with No Evacuation(Example) (7)
Figure3-6MBB with Recommended Light Air
Evacuation(Example).........................................7Figure3-7MBB with Too Much(Full)Evacuation
(Example) (7)
Figure A-1Photo of Testing Apparatus (15)
Tables
Table3-1Dry Packing Requirements (4)
Table3-2Typical HIC Spot Compliance (6)
Table4-1Reference Conditions for Drying Mounted
or Unmounted SMD Packages(User
Bake:Floor life begins counting at
time=0after bake) (8)
Table4-2Default Baking Times Used Prior to Dry-
Pack that were Exposed to Conditions
≤60%RH(MET=24h) (9)
Table4-3Resetting or Pausing the‘‘Floor Life’’
Clock at User Site (9)
Table5-1Moisture Classification Level and Floor Life (11)
Table7-1Recommended Equivalent Total Floor Life
(days)@20°C,25°C&30°C,35°C
For ICs with Novolac,Biphenyl and
Multifunctional Epoxies(Reflow at same
temperature at which the component
was classified)Maximum Percent
Relative Humidity (14)
viHandling,Packing,Shipping,and Use of Moisture/ Reflow and/or Process Sensitive Components
1FOREWORD
The advent of surface mount devices(SMDs)introduced a new class of quality and reliability concerns regarding damage from the solder reflow process,such as cracks and delamination.This document describes the standardized levels offloor-life exposure for moisture/reflow sensitive SMDs along with the handling,packing,and shipping requirements necessary to avoid moisture/reflow related failures.Companion documents J-STD-020and J-STD-075define the classification procedure and JEP113defines the labeling requirements.
For moisture sensitivity,moisture from atmospheric humidity enters permeable packaging materials by diffusion.Assembly processes used to solder SMDs to printed circuit boards(PCBs)expose the entire package body to temperatures higher than 200°C.During solder reflow,the combination of rapid moisture expansion,materials mismatch,and material interface deg-radation can result in cracking and/or delamination of critical interfaces within the device.
Typical solder reflow processes of concern for all devices are infrared(IR),convection/IR,convection,vapor phase reflow (VPR),hot air rework tools,and wave solder,including full immersion.
Non-semiconductor devices may exhibit additional process sensitivities beyond moisture sensitivity such as thermal sensi-tivity,flux sensitivity,or cleaning process sensitivity.
1.1Purpose The purpose of this document is to provide manufacturers and users with standardized methods for handling, packing,shipping,and use of moisture/reflow and process sensitive devices that have been classified to the levels defined in J-STD-020or J-STD-075.These methods are provided to avoid damage from moisture absorption and exposure to sol-der reflow temperatures that can result in yield and reliability degradation.By using these procedures,safe and damage-free reflow can be achieved.The dry-packing process defined herein provides a minimum shelf life of12months from the seal date.
1.2Scope This standard applies to all devices subjected to bulk solder reflow processes during PCB assembly,including plastic encapsulated packages,process sensitive devices,and other moisture sensitive devices made with moisture-permeable materials(epoxies,silicones,etc.)that are exposed to the ambient air.
1.3Assembly Processes
1.3.1Mass Reflow This standard applies to bulk solder reflow assembly by infrared(IR),convection/IR,convection,and vapor phase reflow(VPR)processes.It does not apply to bulk solder reflow processes that immerse the component bodies in molten solder(e.g.,wave soldering bottom mounted components).Such processes are not allowed for many SMDs and are not covered by the component qualifications standards used as a basis for this document.
1.3.2Localized Heating This standard also applies to moisture/reflow sensitive SMD packages that are removed or attached singly by local ambient heating,i.e.,hot air rework.(Refer to Clause6.)
1.3.3Socketed Components This standard does not apply to SMD packages that are socketed and not exposed to solder reflow temperatures during either bulk reflow or rework of adjacent devices.Such SMD packages are not at risk and do not require moisture precautionary handling.
1.3.4Point-to-Point Soldering This standard does not apply to SMD packages in which only the leads are heated to reflow the solder(e.g.,hand-soldering,hot bar attach of gull wing leads,and through hole by wave soldering).The heat absorbed by the package body from such operations is typically much lower than for bulk surface mount reflow or hot air rework and moisture precautionary measures are typically not needed.
1.3.5Aqueous Cleaning For non-cavity SMDs,typical short term aqueous cleaning processes will not impact thefloor life(internal moisture content).Special consideration should be given to non-hermetic cavity packages.
11.4Reliability The methods set forth in this specification ensure that an adequate SMD package reliability can be achieved during and after the PCB assembly operation,when the SMD packages are evaluated and verified by J-STD-020,J-STD-075,and/or by JESD22-A113plus environmental reliability testing.
Note:This specification does not address or ensure solder joint reliability of external interconnects for attached components.
1.5Terms and Definitions
1.5.1Active Desiccant Desiccant that is either fresh(new)or has been baked according to the manufacturer’s recommen-dations to renew it to original specifications.
1.5.2Bar Code Label A manufacturer’s label that includes information in a code consisting of parallel bars and spaces or a2-D matrix format.
Note:For the purpose of this standard,the bar code label is on the lowest level shipping container and includes informa-tion that describes the product(e.g.,part number,quantity,lot information,supplier identification,and moisture-sensitivity level).
1.5.3Bulk Reflow Reflow of multiple components with simultaneous attachment by an infrared(IR),convection/IR,con-vection,or vapor phase reflow(VPR)process.
1.5.4Carrier A pocket tape,tray,tube,or otherfixture used to store and transport devices and components.
1.5.5Desiccant An absorbent material used to maintain a low relative humidity.
1.5.6Floor Life The allowable time period between removal of moisture-sensitive devices from a moisture-barrier bag, dry storage,or dry bake and the solder process.
1.5.7Humidity Indicator Card(HIC)A card on which a moisture-sensitive chemical is applied such that it will make a significant,perceptible change in color(hue),typically from blue(dry)to pink(wet)when the indicated relative humidity is exceeded.
Note:The HIC is packed inside the moisture-barrier bag,along with a desiccant,to aid in determining the level of mois-ture to which the moisture-sensitive devices have been subjected.
1.5.8Manufacturer’s Exposure Time(MET)The maximum cumulative time after bake that components may be exposed to ambient conditions prior to shipment to end user.
1.5.9Moisture-Barrier Bag(MBB)A bag designed to restrict the transmission of water vapor and used to pack moisture-sensitive devices.
1.5.10Moisture-Sensitive Identification(MSID)A symbol indicating that the contents are moisture sensitive.
1.5.11Rework The removal of a component for scrap,reuse,or failure analysis;the replacement of an attached compo-nent;or the heating and repositioning of a previously attached component.
1.5.12Shelf Life The minimum time that a dry-packed,moisture-sensitive device can be stored in an unopened moisture barrier bag(MBB)such that a specified interior bag ambient humidity is not exceeded.
1.5.13SMD Surface mount device.
Note:For the purpose of this standard,SMD is restricted to include only plastic-encapsulated SMDs and other packages made with moisture-permeable materials.
1.5.14Solder Reflow A solder attachment process in which previously applied solder or solder paste is melted to attach
a component to a printed circuit board.
21.5.15Water Vapor Transmission Rate(WVTR)A measure of the permeability of plasticfilm or metallized plasticfilm material to moisture.
2APPLICABLE DOCUMENTS(Normative)
2.1American Society for Testing and Materials(ASTM)1
ASTM F1249Standard Test Method for Water Vapor Transmission Rate Through Plastic Film and Sheeting Using a Modu-lated Infrared Sensor.
ASTM F392Standard Test Method for Flex Durability of Flexible Barrier Materials
2.2Electronic Industries Alliance(EIA,JEDEC)2
EIA-541Packaging Material Standards for ESD Sensitive Items
JESD625Requirements for Handling Electrostatic Discharge Sensitive Devices(ESDS)
JEP113Symbol and Labels for Moisture Sensitive Devices
JESD22-A113Preconditioning of Non-hermetic Surface Mount Components Prior to Reliability Testing
JESD22-A120Test Method for the Measurement of Moisture Diffusivity and Water Solubility in Organic Materials Used in Integrated Circuits
2.3IPC Standards3
IPC-7711Rework of Electronic Assemblies
IPC-7721Repair and Modification of Printed Boards and Electronic Assemblies
2.4Joint Industry Standards4
J-STD-020Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices
J-STD-075Classification of Non-IC Electronic Components for Assembly Processes
2.5Department of Defense5
MIL-PRF-81705Type I-Barrier Materials Flexible,Electrostatic-free,Heat Sealable
MIL-D-34Type II-Desiccant,Activated,Bagged,Packaging Use and Static Dehumidification
3DRY PACKING
3.1Requirements Dry-packing requirements for the various moisture sensitivity levels are shown in Table3-1.The lev-els are determined per J-STD-020,J-STD-075,and/or per JESD22-A113plus environmental reliability testing.As a mini-mum,all materials used in dry packing should conform to EIA-541.
3.2Drying of SMD Packages and Carrier Materials Before Being Sealed in MBBs
3.2.1Drying Requirements-Levels2a-5a SMD packages classified at Levels2a through5a must be dried(see Clause
4)prior to being sealed in MBBs.The period between drying and sealing must not exceed the MET less the time allowed for distributors to open the bags and repack parts.If the supplier’s actual MET is more than the default24hours,then the
1.www.astm.org
2.www.eia.org;www.jedec.org
3.www.ipc.org
4.www.eia.org;www.jedec.org;www.ipc.org
5.http://astimage.daps.dla.mil/quicksearch/
3
actual MET must be used.If the distributor practice is to repack the MBBs with active desiccant,then this time does not need to be subtracted from the MET.
3.2.2Drying Requirements for Carrier Materials Carrier materials,such as trays,tubes,reels,etc.,that are placed in the
MBB can affect the moisture level within the MBB.Therefore,the effect of these materials must be compensated for by baking or,if required,adding additional desiccant in the MBB to ensure the shelf life of the SMD packages.
3.2.3Drying Requirements Suppliers may use the drying effect of normal in-line processes such as post mold cure,
marking cure,and burn-in to reduce the bake time.An equivalency evaluation is recommended to ensure that high tem-perature processing maintains moisture weight gain to an acceptable level.The total weight gain for the SMD package at the time it is sealed in the MBB must not exceed the moisture gain of that package starting dry and then being exposed to 30°C/60%RH for MET hours (less the time for distributors).
3.2.4Excess Time Between Bake and Bag
If the allowable time between bake and bag is exceeded,the SMD packages
must be dried again per Clause 4.
3.3Dry Pack
3.3.1Description Dry pack
and a humidity indicator card packages inside a moisture barrier tive dry-pack configuration is shown 3.3.2Materials
3.3.2.1Moisture Barrier Bag bag shall meet MIL-PRF-81705,for flexibility,ESD protection,ture resistance.The bags shall be Vapor Transmission Rate (WVTR)(0.002g/100in 2)in 24hrs at 40°C dition ‘‘E’’ASTM F 392.The ASTM F 1249.
3.3.2.2Desiccant The desiccant D-34,Type II.Desiccant shall be and absorbent to amounts specified in the standard.Desiccant has a very limited floor life and should be stored and handled per the manufacturer’s recommendation prior to insertion in
the MBB.The desiccant material shall be packaged in moisture permeable bags or pouches.The amount of desiccant used,per moisture barrier bag,shall be based on the bag surface area and WVTR in order to limit the interior relative humidity in the MBB,at the end of the calculated shelf life,to less than 10%at 25°C.
For comparison between various desiccant types,military specifications adopted the UNIT as the basic unit of measure of quantity for desiccant material.A UNIT of desiccant is defined as the amount that will absorb a minimum of 2.85g of water vapor at 20%RH and 25°C.
Table 3-1Dry Packing Requirements
Level
Dry Before Bag
MBB With HIC
Desiccant
MSID Label
Caution Label
1Optional Optional Optional Not Required Not Required if classified at 220-225°C [428-437°F]Required*if classified at
other than 220-225°C [428-437°F]
2Optional Required Required Required Required 2a-5a Required Required Required Required Required 6
Optional
Optional
Optional
Required
Required
*A ‘‘Caution’’label is not required if level and reflow temperature are given,in human readable form,on the barcode label attached to the lowest level shipping container.
Figure 3-1Typical Dry-Pack Configuration for Moisture--Sensitive SMD Packages in Shipping Tubes 4
3.3.2.2.1Desiccant Quantity Calculation When the desiccant capacity at 10%RH and 25°C is known,the following
equation should be used:
U =(0.304*M *WVTR *A)/D
Where:
U =Amount of desiccant in UNITS
M =Shelf life desired in months (see Clause 3.3.6for shelf life)WVTR =Water vapor transmission rate in grams/m 2in 24hrs.A =Total exposed surface area of the MBB in square decimeters
D =The amount of water in grams,that a UNIT of desiccant will absorb at 10%RH and 25°C
When the desiccant capacity at 10%RH and 25°C is not known a conservative value of D =1.40can be used.
Note 1:If it is desired to minimize the amount of desiccant used for dry-packing level 2components,a value of D based on the amount of water in grams,that a UNIT of desiccant will absorb at 60%RH and 25°C must be used in the formula.This value should to be obtained from the desiccant manufacturer.When this option is used,it must be verified that when the component was classified per J-STD-020it must have achieved full saturation during moisture soak.
Note 2:No moisture-absorbing material (e.g.,trays,tubes,reels,foam end caps)should be placed in the dry bag without baking.Any such material that is included increases the amount of desiccant needed to meet the calculated shelf life (see Clause 5.3.1)by an amount based on the moisture content of the material.This can be determined by weighing a represen-tative quantity of material known to be at equilibrium with the manufacturing environment,baking to a new constant weight,and subtracting the final from the initial weight.
Additional UNIT(s)of desiccant,based on 10%RH at 25°C,must be added to absorb the amount of water,in grams,egressed from the packing materials (dunnage)after baking.
3.3.2.2.2Desiccant Handling and Storage Desiccant capacity decreases rapidly when exposed to 30°C/60%RH.There-
fore the desiccant should remain in the manufacturer’s container or stored in a dry cabinet at <5%RH until use.When dry packing,the desiccant shall be removed from the storage container just prior to placing it into the MBB and sealing the MBB.
3.3.2.3Humidity Indicator Card (HIC)At minimum,the HIC shall have
three (3)color spots with sensitivity values of 5%,10%,and 60%RH.An example HIC is shown in Figure 3-2.The spots shall indicate the humidity with a significant,perceptible change in color (hue)as indicated in Table 3-2.Hue shall be tested using the test method in Appendix A.The colors shall be described in writing on the card.The 5%and 10%HIC spots shall be reversible to allow reuse.HIC reuse is not allowed if the 60%spot has changed color.Reuse is not allowed,due to loss of accuracy of the 5%and 10%spot chemistry,if the 60%spot has changed color.It is not required to reuse the same HIC from the MBB if the MBB is to be resealed;a fresh HIC may be used.At a 30°C/60%RH environment the 5%spot shall begin to change from dry indication in a maximum of 4minutes and complete change (to wet indication)in 7minutes and the 10%spot shall begin to change from dry indication in a maximum of 6minutes and complete change (to wet indi-cation)within 10minutes when removed from manufacturer’s original con-tainer.
3.3.2.3.1HIC Paper White blotting paper made from fibrous,cellulosic
material,with a minimum basis weight of,255g/m 2(equivalent to a nomi-nal 170pounds basis weight)shall be used for HICs.
3.3.2.3.2Visual Defects
HICs shall be free from defects including missing spots,tears,improperly located spots,and
indicating color overrunning the black circles.
3.3.2.3.3Preservation HICs should be stored per the manufacturer’s recommendation prior to insertion in the MBB.At
a minimum,the 10%spot shall indicate dry when the cards are removed from the original container.
HUMIDITY INDICATOR
Complies with IPC/JEDEC J-STD-033
LEVEL 2 PARTS LEVEL 2A-5A PARTS Bake parts if 60% is NOT blue Bake parts if 10% is NOT blue and 5%is pink
Do not put this
card into a bag if 60% is pink
M a n u f a c t u r e r I d e n t i f i c a t i o n L o t N u m b e r
60%
10%
5%
IPC-033c-3-2
Figure 3-2Humidity Indicator Card (HIC)
(Example)
3.3.3Labels
3.3.3.1Labels -Moisture Sensitive Identification
Labels relevant to the dry-pack process
are the moisture-sensitive identification’’(MSID)label and the caution label as specified in JEDEC JEP113(see Figures 3-3and 3-4).The MSID label shall be affixed to the lowest-level shipping container that contains the MBB.The caution label shall be affixed to the outside surface of the MBB.The caution label includes fields for the moisture classification level per J-STD-020or process classification level per J-STD-075;the peak package body temperature allowed during reflow soldering (the classification temperature);the floor life;and the bag seal date.If the calculated shelf life is greater than 12months,item #1of the caution label should be changed accordingly.
3.3.3.2Labels -Level 6Requirements Level 6parts not shipped in MBBs shall have both
an MSID
affixed to 3.3.3.3parts maximum moisture other than reflow the caution or to the tion label includes reflow form.
3.3.4shall be 3.3.53.3.5.1anywhere under a Table 3-2
Typical HIC Spot Compliance
Indication at 2%RH Environment
Indication at 5%RH Environment
Indication at 10%RH Environment
Indication at 55%RH Environment
Indication at 60%RH Environment
Indication at 65%RH Environment
5%Spot Blue (dry)Lavender (spot value)change ≥7%hue
Pink (wet)
Pink (wet)Pink (wet)Pink (wet)10%Spot Blue (dry)Blue (dry)Lavender (spot value)change ≥10%hue
Pink (wet)Pink (wet)
Pink (wet)60%Spot
Blue (dry)
Blue (dry)
Blue (dry)
Blue (dry)
Lavender (spot value)change ≥10%hue
Pink (wet)
Note:Other color schemes may be used.
Figure 3-3Moisture--Sensitive Identification Label (Example)
Figure 3-4Moisture-Sensitive Caution Label (Example)
3.3.5.2.1HIC with10%RH Indicated HIC cards where the10%spot indicates wet shall not be used/reused if the bag will be opened and the HIC card inspected within48hours.
3.3.5.2.2HIC with60%RH Indicated HIC shall be discarded if the60%spot has indicated wet.HICs that have been exposed to60%or greater RH will no longer be accurate.
3.3.5.3Moisture Barrier Bag Sealing In actual practice air evacuation is not required(Figure3-5).Light air evacuation may be used to reduce the packaging bulk and enhance carton packing(Figure3-6).Full evacuation shall not be used as it will impede desiccant and HIC performance and possibly lead to MBB puncture(Figure3-7).
3.3.6Shelf Life The calculated shelf life for dry-packed SMD packages shall be a minimum of12months from the bag seal date,when stored in a non-condensing atmospheric environment of<40°C/90%RH.If the calculated shelf life is greater than12months,item#1of the caution label should be changed accordingly(see Figure3-4).
Figure3-5MBB with No Evacuation(Example)
IPC-033c-3-6
with Recommended Light Air EvacuationTable4-1Reference Conditions for Drying Mounted or Unmounted SMD Packages(User Bake:Floor life begins counting at time=0after bake)
Package Body Level
Bake@125°C+10/-0°C
Bake@90°C+8/-0°C
≤5%RH
Bake@40°C+5/-0°C
≤5%RH Exceeding
Floor Life
by>72h
Exceeding
Floor Life
by≤72h
Exceeding
Floor Life
by>72h
Exceeding
Floor Life
by≤72h
Exceeding
Floor Life
by>72h
Exceeding
Floor Life
by≤72h
Thickness ≤1.4mm
25hours3hours17hours11hours8days5days 2a7hours5hours23hours13hours9days7days 39hours7hours33hours23hours13days9days 411hours7hours37hours23hours15days9days 512hours7hours41hours24hours17days10days 5a16hours10hours54hours24hours22days10days
Thickness >1.4mm ≤2.0mm
218hours15hours63hours2days25days20days 2a21hours16hours3days2days29days22days 327hours17hours4days2days37days23days 434hours20hours5days3days47days28days 540hours25hours6days4days57days35days 5a48hours40hours8days6days79days56days
Thickness >2.0mm ≤4.5mm
248hours48hours10days7days79days67days 2a48hours48hours10days7days79days67days 348hours48hours10days8days79days67days 448hours48hours10days10days79days67days 548hours48hours10days10days79days67days 5a48hours48hours10days10days79days67days
BGA package >17mm x17mm or any stacked
die package 2-5a96hours
(See Note2)
As above
per package
thickness and
moisture level
Not applicable As above
per package
thickness and
moisture level
Not applicable As above
per package
thickness and
moisture level
Note1:Table4-1is based on worst-case molded lead frame SMD packages.Users may reduce the actual bake time if technically justified(e.g.,absorption/ desorption data,etc.).In most cases it is applicable to other nonhermetic surface mount SMD packages.If parts have been exposed to>60%RH it may be necessary to increase the bake time by tracking desorption data to ensure parts are dry.
Note2:For BGA packages>17mm x17mm,that do not have internal planes that block the moisture diffusion path in the substrate,may use bake times based on the thickness/moisture level portion of the table.
Note3:If baking of packages>4.5mm thick is required see appendix B.Table4-2Default Baking Times Used Prior to Dry-Pack
that were Exposed to Conditions≤60%RH(MET=24h)
Package Body Thickness Level Bake@125°C+10/-0°C Bake@150°C+10/-0°C
≤1.4mm
2
2a
3
4
5
5a
7hours
8hours
16hours
21hours
24hours
28hours
3hours
4hours
8hours
10hours
12hours
14hours
>1.4mm ≤2.0mm
2
2a
3
4
5
5a
18hours
23hours
43hours
48hours
48hours
48hours
9hours
11hours
21hours
24hours
24hours
24hours
>2.0mm ≤4.5mm
2
2a
3
4
5
5a
48hours
48hours
48hours
48hours
48hours
48hours
24hours
24hours
24hours
24hours
24hours
24hours
Note1:If baking of packages>4.5mm thick is required see appendix B.
Note2:The bake times specified are conservative for packages without blocking planes or stacked die.For a stacked die or BGA package with internal planes that impede moisture diffusion the actual bake time may be longer than that required in Table4-2if packages have had extended exposure to factory ambient before bake.Also the actual bake time may be reduced if technically justified.The increase or decrease in bake time shall be determined using the procedure in JEDEC JESD22-A120(i.e.,<0.002%weight loss between successive readouts)or per critical interface concentration calculations.
Table4-3Resetting or Pausing the‘‘Floor Life’’Clock at User Site
Moisture Sensitivity
Level Exposure Time@
Temp/Humidity Floor Life
Desiccator Time@
Relative Humidity Bake Reset Shelf Life
2,2a,3,4,5,5a
Anytime
≤40°C/85%RH reset NA Table4.1
Dry Pack
after Bake
2,2a,3,4,5,5a
>floor life
≤30°C/60%RH reset NA Table4.1
Dry Pack
after Bake
2,3,3
>12hrs
≤30°C/60%RH reset NA Table4.1
Dry Pack
after Bake
2,2a,3
≤12hrs
≤30°C/60%RH reset
5X exposure time
≤10%RH NA NA
4,5,5a
>8hrs
≤30°C/60%RH reset NA Table4.1
Dry Pack
after Bake
4,5,5a
≤8hrs
≤30°C/60%RH reset
10X exposure time
≤5%RH NA NA
2,2a,3Cumulative time
<floor life
≤30°C/60%RH
pause
Anytime
≤10%RH NA NA4.1.2Short Duration Exposure Previously dry SMD packages,which have been exposed only to ambient conditions not exceeding30°C/60%RH may be adequately dried by room temperature desiccation using dry pack or a dry cabinet.
4.1.2.1Moisture Sensitivity Levels2-3For moisture sensitivity Levels2,2a,3withfloor-life exposure not greater than 12hours,a minimum desiccating period of5X the exposure time is required to dry the SMD packages enough to reset the floor-life clock(see Table4-3).This can be accomplished by dry pack according to Clause3.3or a dry cabinet that is capable of maintaining not greater than10%RH.
For components exposed anytime less than their statedfloor life,dry packing or placing the components in a dry cabinet maintaining not greater than10%RH,will stop/pause thefloor-life clock as long as the cumulativefloor life meets the con-ditions in Table5-1and/or Table7-1.
4.1.2.2Moisture Sensitivity Levels4,5,5a For moisture sensitivity Levels4,5,5a withfloor-life exposure not greater than8hours,a minimum desiccating period of10X the exposure time is required to dry the SMD packages enough to reset thefloor-life clock(see Table4-3).This can be accomplished by a dry cabinet that is capable of maintaining not greater than5%RH.
Once thefloor-life clock has been reset,refer to Clause5.3for safe storage conditions.
4.2General Considerations for Baking The oven used for baking shall be vented and capable of maintaining the required temperatures at less than5%RH.
4.2.1High Temperature Carriers Unless otherwise indicated by the manufacturer,SMD packages shipped in high tem-perature carriers can be baked in the carriers at125°C.
4.2.2Low Temperature Carriers SMD packages shipped in low temperature carriers may not be baked in the carriers at any temperature higher than40°C.If a higher bake temperature is required,SMD packages must be removed from the low temperature carriers to thermally safe carriers,baked,and returned to the low temperature carriers.
Note1:Manual handling may increase the risk of mechanical and/or ESD damage.
Note2:If SMD packages are placed in dry bags with unbaked carriers,refer to Clause3.3.2.2.
4.2.3Paper and Plastic Container Items Paper and plastic container items such as cardboard boxes,bubble pack,plas-tic wrap,etc.,shall be removed from around the carriers prior to baking.Rubber bands around tubes and plastic tray ties must also be removed prior to high temperature(125°C)bake.
4.2.4Bakeout Times Bakeout times start when all SMD packages reach the specified temperature.
4.2.5ESD Protection Proper ESD handling precautions shall be observed,per JESD62
5.This is particularly critical if SMD packages are handled under low humidity conditions(e.g.,in a dry environment,after baking,etc.).
4.2.6Reuse of Carriers The appropriate materials specification should be consulted before reusing carriers.
4.2.7Solderability Limitations
4.2.7.1Oxidation Risk Baking SMD packages may cause oxidation and/or intermetallic growth of the terminations,which if excessive can result in solderability problems during board assembly.The temperature and time for baking SMD pack-ages are therefore limited by solderability considerations.Unless otherwise indicated by the supplier,the cumulative bake time at a temperature greater than90°C and up to125°C should not exceed96hours.If the bake temperature is not greater than90°C,there is no practical limit on bake time.Bake temperatures higher than125°C are not allowed without consult-ing the supplier.
4.2.7.2Carrier Out-gassing Risk Care should be taken to ensure that out-gassing of materials from the component carri-ers does not occur to any significant extent,such that solderability might be affected.
5USE
Upon opening the MBB,thefloor-life clock starts.If an MBB is opened and the ambient conditions are other than 30°C/60%RH,the procedures in Clause7should be followed.
5.1Incoming Bag Inspection
5.1.1Upon Receipt Dry-packed SMD packages should be inspected for a bag seal date located on the caution or bar code label to determine remaining shelf life.The bags should be inspected to verify there are no holes,gouges,tears,punctures, or openings of any kind that would expose either the contents or an inner layer of a multilayer bag.If openings are found and the humidity indicator card(HIC)indicates maximum humidity has been exceeded,then the parts should be baked for 48hours at125°C or using the saturated bake times of Table4-1.This will reset thefloor life if the parts to be used and shelf life if the parts are to be dry packed.
5.1.2Component Inspection Intact bags may be opened for component inspection by cutting at the top of the bag near the seal.If the bags are opened under factory ambient conditions,see Clause4.1.2.
5.2Floor Life Thefloor life of SMDs per Table5-1will be modified by environmental conditions other than 30°C/60%RH.Refer to Clause7to determine maximum allowable time before rebake would be necessary.If partial lots are used,the remaining SMD packages must be resealed or placed in safe storage within one hour of bag opening(see Clause5.3).If one hour exposure is exceeded,refer to Clause4.1.
Table5-1Moisture Classification Level and Floor Life
Moisture Sensitivity Level Floor Life(out of bag)at factory ambient≤30°C/60%RH or as stated 1Unlimited at≤30°C/85%RH
21year
2a4weeks
3168hours
472hours
548hours
5a24hours
6Mandatory bake before use.After bake,must be reflowed within the time limit specified on the label.
5.3Safe Storage Safe storage means dry SMD packages held in a controlled humidity condition such that thefloor-life clock remains at zero.Acceptable safe storage conditions for SMD packages classified as Level2through5a are listed below.
5.3.1Dry Pack Dry-packed SMD packages in intact MBBs,stored per Clause3.3,shall have a calculated shelf life of at least12months from the bag seal date shown on the caution or bar code label.
5.3.2Shelf Life The minimum calculated shelf life is12months from bag seal date.If the actual shelf life has exceeded 12months,but less than2years,from the bag seal date and the humidity indicator card(HIC)(see Clause5.5.1)indicates that baking is not required,then it is safe to reflow the components per the original MSL rating.Although unanticipated, factors other than moisture sensitivity could affect the total shelf life of components.
Note:An HIC that has been continuously sealed in the MBB is typically accurate for at least2years.
5.3.3Dry Atmosphere Cabinet A storage cabinet which maintains low humidity by purging with dry air or nitrogen at 25±5°C.The cabinet must be capable of recovering to its stated humidity rating within one hour from routine excursions such as door opening/closing.
5.3.3.1Dry Cabinet at10%RH SMD packages not sealed in a MBB may be placed in a dry atmosphere cabinet,main-tained at not greater than10%RH.A dry cabinet should not be considered a MBB.Storage of SMD packages in a dry cabi-net should be limited to a maximum time per Table7-1.If the time limit is exceeded the packages should be baked accord-ing to Table4-2to restore thefloor life.5.3.3.2Dry Cabinet at5%RH SMD packages not sealed in a MBB may be placed in a dry atmosphere cabinet,main-tained at not greater than5%RH.Storage in a dry cabinet may be considered equivalent to storage in a dry pack with unlimited shelf life.
5.4Reflow Reflow includes single and multi-pass assembly reflow and single component attach/removal for rework.
5.4.1Opened MBB After a dry pack(MBB)has been opened,all SMD packages within that bag must complete all sol-der reflow processing,including rework,prior to the statedfloor life,resealed in the MBB,or stored in a dry atmosphere cabinet per Clause4.1.If thefloor life or factory ambient conditions are exceeded,refer to Clause5.5.2.
5.4.2Reflow Temperature Extremes During reflow the component body temperature must not exceed the rated value stated on the caution label.The body temperature during reflow directly influences component reliability.
Note1:The component body temperature may be very different from the lead or solder ball temperature,particularly in IR and IR/convection processes,and should be checked separately.
Note2:Some hot air attach processes may require heating the component body to temperatures hotter than225°C.If that temperature exceeds the classification temperature,moisture precautions and/or time-temperature limitations beyond the scope of this specification may be required.The supplier should be consulted.
5.4.3Additional Thermal Profile Parameters During reflow,the additional thermal profile parameters stated in JESD22-A113should not be exceeded.Although the body temperature during reflow is the most critical parameter,other profile parameters such as the total exposure time to hot temperatures and the heating rates may also influence component reliability.
5.4.4Multiple Reflow Passes If more than one reflow pass is used,care must be taken to ensure that no moisture sensi-tive SMD packages,mounted or unmounted,have exceeded theirfloor life prior to thefinal pass.If any component on the board has exceeded itsfloor life,the board needs to be baked prior to the next reflow.Refer to Clause6for the baking of populated boards.
Note1:Thefloor-life clock is NOT reset by any reflow or rework process.
Note2:Water clean processes after thefirst reflow can be an additional source of moisture for cavity packages in which water may be entrapped.This may present an additional risk,which should be evaluated.
5.4.5Maximum Reflow Passes A maximum of three reflow passes is allowed per component.If more than three are required for any reason,the supplier should be consulted(reference J-STD-020).
5.5Drying Indicators Events and conditions that require component drying prior to reflow or continued safe storage. 5.5.1Excess Humidity in the Dry Pack Excess humidity in the dry pack is noted by the humidity indicator card(HIC). It can occur due to misprocessing(e.g.,missing or inadequate desiccant),mishandling(e.g.,tears or rips in the MBB),or improper storage.The HIC should be read immediately upon removal from the MBB.For best accuracy,the HIC should be read at23±5°C.The following conditions apply regardless of the storage time(i.e.,whether or not the shelf life has been exceeded).
Note:Witness cards may be available from the HIC manufacturer if needed to confirm the wet/dry colors.
5.5.1.1HIC Indication1If the5%,10%,and60%RH spots indicate dry,then Levels2,2a,3,4,5,and5a parts are still adequately dry.If the bag is to be resealed refer to Clause4.1.
5.5.1.2HIC Indication2If the5%RH spot indicates wet and the10%RH spot does not indicate dry,and the60%spot indicates dry,the Levels2a,3,4,5,and5a parts have been exposed to an excessive level of moisture,and drying shall be done per Clause4.Level2parts are still adequately dry.
5.5.1.3HIC Indication3If the5%,10%,and60%RH spots indicate wet,Level2parts have been exposed to an exces-sive level of moisture,and drying shall be done per Clause4.
Note:Discard HICs where the60%spot indicates wet.5.5.2Floor Life or Ambient Temperature/Humidity Exceeded If thefloor life or ambient temperature/humidity condi-tions per Table5-1have been exceeded,SMD packages must be dried per Clause4prior to reflow or safe storage. Note:If the factory ambient temperature and/or humidity conditions per Table5-1cannot be met,the componentfloor life must be derated to compensate.Floor-life derating is discussed in Clause7.
5.5.3Level6SMD Packages SMD packages classified as Level6must be dried by baking,and then reflowed within the time limit specified on the label.
6BOARD REWORK
6.1Component Removal,Rework,and Remount If a component is to be removed from the board,it is recommended that localized heating be used and the maximum body temperatures of any surface mount component on the board not exceed200°C.This method will minimize moisture related component damage.If any component temperature exceeds200°C,the board must be baked dry per Clause6.2prior to rework and/or component removal.Component temperatures shall be measured at the top center of the package body.Any SMD package that has not exceeded itsfloor life can be exposed to a maximum body temperature as high as its maximum reflow temperature as defined by J-STD-020.
Note:Socketed components should be removed prior to rework.
6.1.1Removal for Failure Analysis Not following the requirements of Clause6.1may cause moisture/reflow damage that could hinder or completely prevent the determination of the original failure mechanism.
6.1.2Removal and Remount Removal and reinstallation or replacement of a component should be conducted following IPC-7711or IPC-7721.If a component is to be removed and reinstalled it may be necessary tofirst bake the printed wir-ing assembly to eliminate moisture from the component.Table4-1may be used as a guide in identifying an appropriate bake cycle.When identifying a bake cycle,the maximum exposure temperature and maximum rate of temperature change of components and materials on the subject printed wiring assembly must be considered,and an appropriate time tempera-ture profile(see IPC-7711)used.An SMD package shall not exceed its MSL ratings per J-STD-020at any time during replacement.Localized replacement reflow heating is recommended so that the entire board is not re-subjected to reflow temperature profiles.
Note:Temperatures on neighboring SMD packages above the melting point of the solder being used may cause some sol-der joints to partially reflow,which may result in a potential solder joint reliability concern.
6.2Baking of Populated Boards A default board assembly bake-out temperature of125°C shall be used,except in cases where components and/or board materials cannot withstand this condition.Examples of temperature sensitive components include organic LEDs,batteries,and electrolytic capacitors.With component and board temperature restrictions in mind, choose a bake temperature from Table4-1;then determine the appropriate bake duration based on the component to be removed.For additional considerations see IPC-7711and IPC-7721.
7DERATING DUE TO FACTORY ENVIRONMENTAL CONDITIONS
Factoryfloor-life exposures for SMD packages removed from the dry bags will be a function of the ambient environmental conditions.A safe,yet conservative,handling approach is to expose the SMD packages only up to the maximum time lim-its for each moisture sensitivity level as shown in Table5-1.This approach,however,does not work if the factory humid-ity or temperature is greater than the testing conditions of30°C/60%RH.A solution for addressing this problem is to der-ate the exposure times based on the knowledge of moisture diffusion in the component packaging materials(refer to JESD22-A120).Recommended equivalent totalfloor-life exposures can be estimated for a range of humidities and tempera-tures based on the worst case exposure conditions and the nominal plastic thickness for each device.Table7-1lists equiva-lent deratedfloor lives for humidities ranging from5-90%RH for temperatures of20°C,25°C,30°C,and35°C.This table is applicable to SMDs molded with novolac,biphenyl,or multifunctional epoxy mold compounds.The following assumptions were used in calculating Table7-1:
1.Activation Energy for diffusion=0.35eV(smallest known value).
2.For≤60%RH,use Diffusivity=0.121exp(-0.35eV/kT)mm2/s(this uses smallest known Diffusivity@30°C).
3.For>60%RH,use Diffusivity=1.320exp(-0.35eV/kT)mm2/s(this uses largest known Diffusivity@30°C).Table7-1Recommended Equivalent Total Floor Life(days)@20°C,25°C&30°C,35°C For ICs with Novolac,Biphenyl and Multifunctional Epoxies(Reflow at same temperature at which the component was classified)Maximum Percent Relative Humidity
Package Type and Body Thickness
Moisture
Sensitivity
Level5%10%20%30%40%50%60%70%80%90%
Body Thickness is ≥3.1mm including: PQFPs>84pins PLCCs(square)
All MQFPs
All BGAs≥1mm Level2a
∞
∞
∞
∞
∞
∞
∞
∞
94
124
167
231
44
60
78
103
32
41
53
69
26
33
42
57
16
28
36
47
7
10
14
19
5
7
10
13
4
6
8
10
35°C
30°C
25°C
20°C Level3
∞
∞
∞
∞
∞
∞
∞
∞
8
10
13
17
7
9
11
14
6
8
10
13
6
7
9
12
6
7
9
12
4
5
7
10
3
4
6
8
3
4
5
7
35°C
30°C
25°C
20°C Level4
∞
∞
∞
∞
3
5
6
8
3
4
5
7
3
4
5
7
2
4
5
7
2
3
5
7
2
3
4
6
2
3
3
5
1
2
3
4
1
2
3
4
35°C
30°C
25°C
20°C Level5
∞
∞
∞
∞
2
4
5
7
2
3
5
7
2
3
4
6
2
2
4
5
1
2
3
5
1
2
3
4
1
2
2
3
1
1
2
3
1
1
2
3
35°C
30°C
25°C
20°C Level5a
∞
∞
∞
∞
1
2
3
5
1
1
2
4
1
1
2
3
1
1
2
3
1
1
2
3
1
1
2
2
1
1
1
2
1
1
1
2
1
1
1
2
35°C
30°C
25°C
20°C
Body Thickness is
<3.1mm down to2.1mm
including
PLCCs(rectangular)
18-32pins
SOICs(wide body)
SOICs≥20pins
PQFPs≤80pins Level2a
∞
∞
∞
∞
∞
∞
∞
∞
∞
∞
∞
∞
∞
∞
∞
∞
58
86
148
∞
30
39
51
69
22
28
37
49
3
4
6
8
2
3
4
5
1
2
3
4
35°C
30°C
25°C
20°C Level3
∞
∞
∞
∞
∞
∞
∞
∞
12
19
25
32
9
12
15
19
7
9
12
15
6
8
10
13
5
7
9
12
2
3
5
7
2
2
3
5
1
2
3
4
35°C
30°C
25°C
20°C Level4
∞
∞
∞
∞
5
7
9
11
4
5
7
9
3
4
5
7
3
4
5
6
2
3
4
6
2
3
4
5
1
2
3
4
1
2
2
3
1
1
2
3
35°C
30°C
25°C
20°C Level5
∞
∞
∞
∞
3
4
5
6
2
3
4
5
2
3
3
5
2
2
3
4
2
2
3
4
1
2
3
4
1
1
2
3
1
1
1
3
1
1
1
2
35°C
30°C
25°C
20°C Level5a
∞
∞
∞
∞
1
2
2
3
1
1
2
2
1
1
2
2
1
1
2
2
1
1
2
2
1
1
2
2
1
1
1
2
0.5
0.5
1
2
0.5
0.5
1
1
35°C
30°C
25°C
20°C
Body Thickness is <2.1mm including SOICs<18pins
All TQFPs
All TSOPs
All BGAs<1mm body thickness Level2a
∞
∞
∞
∞
∞
∞
∞
∞
∞
∞
∞
∞
∞
∞
∞
∞
∞
∞
∞
∞
∞
∞
∞
∞
17
28
∞
∞
1
1
2
2
0.5
1
1
2
0.5
1
1
1
35°C
30°C
25°C
20°C Level3
∞
∞
∞
∞
∞
∞
∞
∞
∞
∞
∞
∞
∞
∞
∞
∞
∞
∞
∞
∞
8
11
14
20
5
7
10
13
1
1
2
2
0.5
1
1
2
0.5
1
1
1
35°C
30°C
25°C
20°C Level4
∞
∞
∞
∞
∞
∞
∞
∞
∞
∞
∞
∞
7
9
12
17
4
5
7
9
3
4
5
7
2
3
4
6
1
1
2
2
0.5
1
1
2
0.5
1
1
1
35°C
30°C
25°C
20°C Level5
∞
∞
∞
∞
∞
∞
∞
∞
7
13
18
26
3
5
6
8
2
3
4
6
2
2
3
5
1
2
3
4
1
1
2
2
0.5
1
1
2
0.5
1
1
1
35°C
30°C
25°C
20°C Level5a
∞
∞
∞
∞
7
10
13
18
2
3
5
6
1
2
3
4
1
1
2
3
1
1
2
2
1
1
2
2
1
1
1
2
0.5
1
1
2
0.5
0.5
1
1
35°C
30°C
25°C
20°C
∞Represents indefinite exposure time allowed at conditions specified.APPENDIX A
Test Method for Humidity Indicator Card used
with Electronic Component Packaging
Note:It is intended to make the HIC test method and criteria a separate standard in the future.
HIC Testing Method To function properly,the spots must show a visually perceptible color change to indicate a change in the amount of humidity.This testing method uses a colorimeter to measure the color(hue)of humidity indicating spots.The percentage of change in hue from one humidity value to another is then calculated.
Testing Apparatus A test environment capable of maintaining atmosphere at a temperature of23±1°C and a relative humidity from2%-65%±1%RH.The cards inside the chamber must be observable from outside the chamber.Nominally, an acrylic box with a volume of approximately2cubic feet,having facilities for access to the box interior while maintain-ing atmosphere is used.Refer to Figure A-1.Humidity conditions can be achieved by placing combinations of molecular sieve desiccant,glycerin,and water inside the chamber.
•A colorimeter capable of measuring L,a*,and b*values(AccuProbe HH06,Accuracy Microsensors,Pittsford,NY or equivalent)
•An electronic hygrometer,with the minimum range of1%RH to90%RH.
Testing Procedure Place the sealed container of cards into the chamber.Set the chamber to thefirst humidity listed in Table3-2.Open the container and suspend two cards inside the chamber so that the spots can be observed from outside the chamber.Allow the cards to condition for a minimum of24hours.All testing occurs inside the chamber,while the cards are exposed to the test humidity.Using a colorimeter,measure and record the L,a*,and b*values for each spot on the cards. Set the chamber for the next humidity and continue in this manner until data has been collected for all conditions.
HIC Spot Compliance:
Hue Value Reading
RH Indicating Spot Initial(Dry)Conditioned(Spot Value) 5%2%5%
10%5%10%
60%55%60%
Note:Printing in the indicating spot(colored area)will affect hue measurement.Spots without printing shall be tested.
Data Analysis Using the a*and b*data,calculate the hue value for each spot at each humidity condition in Table3-2 where:
If a*and b*are negative then:
Hue=the absolute value of ARCTAN(b*/a*)
If a*and b*are positive,or if a*is positive and b*is
negative then:
Hue=180+ARCTAN(b*/a*)
If a*is negative and b*is positive then:
Hue=360+ARCTAN(b*/a*)
Calculate the percent change in hue value at the humidity val-
ues shown in Table3-2.Accept cards that show a10%or
greater change in hue value reading from initial dry to the
conditioned spot value per the above spot compliance table.
Cards with spots that do not indicate dry or wet conditions,
per Table3-2,should be rejected.
Figure A-1Photo of Testing Apparatus
APPENDIX B
Derivation of Bake Tables
Bake Tables 4.1and 4.2were calculated using the following assumptions/approach:1.Assume Fickian 1-D diffusion and Henry’s Law apply:
∂C
∂t =D ∂2C ∂x
2(Fick’s Law )C Sat (@surface)∝%RH in ambient atmosphere (Henry’s Law)Where C as a function of time (t)is:
C (t )=C Sat
(1−
4π
Σn =0
∞{
(−1)n
(2n +1)
e −D (2n +1)2π2t /4L
2})
2.Diffusivity =6.2exp (-0.445eV/kT)mm 2/s,(assumes slow diffusing mold compound)a.D 30°C =2.48x10-7mm 2/s b.D 40°C =4.27x10-7mm 2/s c.D 90°C =4.13x10-6mm 2/s d.D 125°C =1.44x10-5mm 2/s
3.Define:
a.L centerline =critical thickness,e.g.,thickness of package /2
b.C Critical =concentration at L centerline for given MSL (based on 30°C/60%RH exposure +24hr MET preconditioning)
c.C Centerline =concentration at L centerline for any exposure condition 4.Impose following two exposure conditions:
a.MSL +>72hr exposure (assume saturated at 30°C/85%RH where C Sat =7.8mg/cm 3)
b.MSL +≤72hr exposure (assume ambient at 30°C/60%RH where C Sat =5.3mg/cm 3)
5.Calculate minimum time @Bake temperature for cases 4a and 4b where an additional MSL exposure will keep C Centerline
APPENDIX C Changes in J-STD-033C Reference J-STD-033B.1J-STD-033C Forward,Purpose,Scope Forward,Purpose,Scope Expanded Scope 1.3Assembly Processes Added1.3.5Aqueous Cleaning 2.2 2.2Added Reference J-STD-075 3.3.2.2.1 3.3.2.2Changed desiccant calculation Removed formula U=5X10-3A 3.3.2.2.2Added3.3.2.2.2Desiccant Handling and Storage Figure3-2Figure3-2Modified HIC Figure 3.3.2.3 3.3.2.3Wording additions/changes 3.3.3.1 3.3.3.1Wording additions/changes Figure3-4Figure3-4New Caution Label 3.3.4 3.3.4Modified wording-see3.3.5.3 3.3.5Added Dry-Pack Precautions 3.3.5.3 3.3.4‘‘Moisture Barrier Bag Sealing’’-Modified wording-see3.4 MBB Figures Added Figures3-5,3-6,3-7 3.3.6 3.3.5Added sentence 44Added Note Table4-1,4-2Table4-1,4-2Added temp tolerance Table4-1Table4-1Added sentence to Note1 4.1.2 4.1.2Removed last sentence 4.2.7.1 4.2.7.1Changed‘‘shall’’to‘‘should’’ 55Changed wording 5.1.1 5.1.1Added wording 5.3.2 5.3.2Modified2nd sentence and changed Note 6.1 6.1Added Note Editorial Changes throughout 17IPC/JEDEC J-STD-033C February2012 This Page Intentionally Left Blank 18Standard Improvement Form IPC/JEDEC J-STD-033C The purpose of this form is to provide the Technical Committee of IPC with input from the industry regarding usage of the subject standard.Individuals or companies are invited to submit comments to IPC.All comments will be collected and dispersed to the appropriate committee(s). If you can provide input,please complete this form and return to: IPC 3000Lakeside Drive,Suite309S Bannockburn,IL60015-1249 Fax:847615.7105 E-mail:answers@ipc.org 1.I recommend changes to the following: Requirement,paragraph number Test Method number,paragraph number The referenced paragraph number has proven to be: Unclear Too Rigid In Error Other 2.Recommendations for correction: 3.Other suggestions for document improvement: Submitted by: Name Telephone Company E-mail Address City/State/Zip Date ®Association Connecting Electronics Industries ® 3000 Lakeside Drive, Suite 309 S Bannockburn, IL 60015 847-615-7100 tel 847-615-7105 fax www.ipc.org ISBN#978-1-61193-037-5
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