
• Thick film manufacturing method,ceramic substrate, Silver Alloy fusing element
• -50℃~125℃ operating temperature
• Excellent environmental integrity
• RoHS compliant
• Halogen-free
• LED lighting
• PC related equipment and peripherals (Hard
Driver, Printer, etc.)
• Portable devices (Mobile phone, PDA battery
Charger, etc.)
•Power supply
•Consumer Electronics
• Wireless base station
*Measured at ≤10% rated current and 25℃
** Melting I2T at 10 times of rated current
Agency File Number Ampere Range
JDYX2.E319540 1A
JDYX8.E319540 1A
Certificate File Number
ISO9001:2008 J13Q20625R1M
ISO14001:2004 J13E20626R1M
ISO/TS16949:2009 0181329
Part Number Marking
Current
Rating
(A)
Voltage
Rating
Interrupting
Rating
Max
Cold
DCR*(Ω)
Typical
I2T**
(A2S) S2512-V2-1.0A H 1.0 250V AC
100A@250
V AC
100A@125
V DC
0.300 1.0
General
Application
Agency / Certificate Information
Ordering Information
Catalo
S 2512- V2-1.0A
Shape & Dimensions: (mm)
L(mm) W(mm) T(mm) B(mm) A(mm)
6.40±0.20 3.25±0.20 0.55±0.20 0.85±0.20 0.30±0.20
Components Material
Substrate
Ceramic
Terminations Silver over-plated with nickel and tin (100%) Element
Silver Alloy
Dimensions A(mm) B(mm) C(mm) D(mm)
Spec
4.50±0.50 8.50±0.50 3.50±0.50 2.00±0.50
Catalog Symbol
Dimensions
Recommended Land Patterns
Materials
B
A
D
C
“1.0A” Ampere Rating: 1A
“V2” V = fast acting, 2=250V ac
“2512” Size Number: 2512=6.4mm×3.2mm physical size “S” Symbol of SART
Time Current Curve:
• The current carrying capacity will be affected by ambient temperature which was showed in the figure.
•This current derating curve is for fusing characteristics.
Example,
Work Temp:80℃,
Temp derating factor = 91% I actual = I normal / 0.91
Time Current Curve
Temperature Derating Curve
Ampere Rating % of Current
Rating
Opening Time 1A 100% >4 hours 1A 350%
≤10sec
I 2T vs Time Curve
Electrical Characteristics Temperature in degrees ℃
T e m p d e r a t i n g f a c t o r %
0.0001
0.0010.01
0.1
1
10
1000.1
1
10
100
1000
T i m e (s e c o n d s )
Current (Amperes)
Time Current Curves
0.01
0.1
1
10
100
1000
0.0001
0.01
1
100
I 2T (A 2S )
Time (Seconds)
I 2T vs.Time Curve
Reliability Test:
***
Fuse mounted on board with 1-oz Cu trace
Item
Test condition/ Methods Performance Standard Voltage Drop
100% In; Temperature in fuse was
stabilized
Individual values deviate from mean value:<15% IEC 60127-1
Time/Current
100% In
No Fusing;4hours Min.
Refer to SART
Spec 350% In*** Within 10sec
1000% In***
>10ms
Endurance Test 100% In, 1h on,15min off, 100 cycles;
followed by 1h at 125%In
│△R │<10% Legible appearance
IEC 60127-1 Temperature Rise 100%In │△T │<75℃
UL248-14 Interrupting Ability
100A@250V AC 100A@125V DC
Without permanent arcing, ignition and bursting of
fuse link
UL248-14 Solderability 240℃±5℃,3sec±0.5sec
95% coverage Min. IEC60127-4 IEC60068-2-20 MIL-STD-202 Resistance to Soldering 260℃±5℃,10sec±0.5sec
│△R│<10% Legible appearance
MIL-STD-202 IEC60127-4 Bending Test Distance between holding points :90mm; Bending :1mm ; time:10sec
│△R │<10%
No mechanical damages IEC 60127-4 High Temperature Operating Life 70℃±2℃, 96hours, at 60% In
│△R │<10%; no fusing
MIL-STD-202 M1243.ethod
108 Low Temperature Storage
-55℃±2℃, 96hours │△R │<10%
IEC60068-2-1
High Temperature Storage 125℃±2℃, 96hours │△R │<10% IEC60068-2-2 Humidity
(steady state) 40℃±2℃, 90%~95%RH, 1000 hours │△R │<10% MIL-STD-202
Method 103 Salt Spray 5% salt solution ,48hoursexposure │△R│<10% Legible appearance MIL-STD-202 Method 101 Thermal Shock
5 cycles between -55℃/+125℃, 60 minutes ;each extreme
│△R│<10%
No mechanical damages
IEC 60068-2-14
Reliability Test
1. Infrared Reflow: Temperature :260℃ Time :5secMax.
Recommend Reflow profile
2.Wave soldering
3.Hand Soldering Reservoir Temperature :260℃ Temperature :350℃ Time in Reservoir :10secMax. Time :5secMax.
1.Embossed Tape Dimensions
Profile Feature Pb-Free Assembly AverageRamp-Up Rate(Ts max to Tp) 3℃/s Max. Preheat
Temperature Min(Ts min ) Temperature Max(Ts max ) Time(Ts min toTs max )
150℃ 200℃
60sec~120sec Peak Temperature(Tp) 260℃ Time within 5℃ of actual Peak Temperature(Tp) 5sec Melting tin time(T L ) 20sec~30sec Ramp-Down Rate
6℃/s Max. Time 25℃ to Peak Temperature
8 minutes Max.
Type
A(mm)
B(mm)
E(mm)
F(mm)
W(mm)
P0(mm)
P1(mm)
P2(mm)
D0(mm)
T(mm)
2512 3.40±0.10 6.73±0.10 1.75±0.10 5.50±0.10 12.00±0.10 4.00±0.10 4.00±0.10 2.00±0.05 1.50+0.10/-0 0.81±0.10
Recommended Solder Curve
Packaging
Top Tape
Resistor
Embossed Tape
2.Reel Dimensions
Type
A(mm) N(mm) C(mm) D(mm) B(mm) G(mm) T(mm)
2512
178.00±2.00 57.00±0.20 13.00±0.50 21.00±0.50 2.00±0.50 13.00±0.50 15.50±1.50
● The ambient temperature shall between 5℃~30℃.
● The relative humidity recommended for storage is between 25%~60%.
● Sealed plastic bags with desiccant shall be used to reduce the oxidation of the
termination and shall only be opened prior to use. The products shall not be stored in areas where harmful gases containing sulfur or chlorine are present.
Packaging style
Tape and Reel
Type 2512 Quantity(PCS )
4000
Storage
Number of Package
