二极管 5817-581919

List

List.................................................................................................Package outline...............................................................................Features..........................................................................................Maximum ratings .............................................................................Rating and characteristic curves........................................................Pinning information...........................................................................Marking...........................................................................................Suggested solder pad layout.............................................................Packing information..........................................................................Reel packing....................................................................................Suggested thermal profiles for soldering processes.............................High reliability test capabilities...........................................................Mechanical data...............................................................................

Features

Low profile surface mounted application in order to

optimize board space.

Low power loss, high efficiency.

High current capability , low forward voltage drop.High surge capability .

Guardring for overvoltage protection.Ultra high-speed switching.

Silicon epitaxial planar chip, metal silicon junction.Lead-free parts meet environmental standards of MIL-STD-19500 /228

• • • • • • • • Mechanical data

• Epoxy : UL94-V0 rated flame retardant • Case : Molded plastic, MELF / DO-213AB

• Terminals :Plated terminals, solderable per MIL-STD-750,

Method 2026

• Mounting Position : Any

• Weight : Approximated 0.02 gram

Package outline

1A Surface Mount Schottky Barrier Rectifiers - 20V-40V o

Maximum ratings (AT T =25C unless otherwise noted)

A

PARAMETER

CONDITIONS Forward rectified current Forward surge current Reverse current Thermal resistance Diode junction capacitance Storage temperature

See Fig.2

8.3ms single half sine-wave superimposed on rate load (JEDEC methode)f=1MHz and applied 4V DC reverse voltage

Symbol

MIN.TYP.MAX.UNIT I O I FSM I R R èJA C J T STG

A A mA

O

C/W O C

pF

1.0251.0+175-65

80SM5817SM5818SM5819

203040

142128

203040

-55 to +125

SYMBOLS V RRM

(V)V RMS V R (V)(V)*1

*2

*3

*1 Repetitive peak reverse voltage *2 RMS voltage

*3 Continuous reverse voltage *4 Maximum forward voltage

O V = V T = 25C R RRM A O V = VRRM T = 100C R A Junction to ambient

110

10

V F (V)

*4

0.500.50

0.45O

(C) Operating temperature T ,J

Pinning information

Marking

Type number Marking code SM5817 -SM5818 - SM5819 -

Suggested solder pad layout

Dimensions in inches and (millimeters)

C

B 0.079 (2.00)

A 0.118 (3.00)

C 0.130 (3.30)

PACKAGE MELF

Packing information

Item

Tolerance MELF

Carrier width Carrier length Carrier depth Sprocket hole

13" Reel outside diameter 7" Reel outside diameter 13" Reel inner diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Reel width

Overall tape thickness Tape width P 0P 1E B C d F T W P A D D D 1D 1D 2W 1

Symbol 0.10.10.1min min 0.50.10.31.0

0.10.10.10.10.10.12.02.0unit:mm

1.50330178.00506

2.001

3.001.755.50

4.004.002.000.2312.0018.00

Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.

3.005.33

3.00D

Reel packing

Profile Feature Soldering Condition o Average ramp-up rate(T L to T P ) <3C/sec Preheat

o -Temperature Min(Tsmin) 100C o -Temperature Max(Tsmax) 150C -Time(min to max)(t s ) 60~120sec Tsmax to T L

o -Ramp-upRate <3C/sec Time maintained above:

o -Temperature(T L ) 183C -Time(t L ) 60~150sec o o Peak Temperature(T P ) 255C-0/+5C o Time within 5C of actual Peak Temperature(t P )

o Ramp-down Rate <6C/sec o Time 25C to Peak T emperature <6minutes

3.Flow (wave)soldering (solder dipping)

o o 1.Storage environment: Temperature=10C~35C Humidity=65%±15%2.Reflow soldering of surface-mount devices

10~30sec

Suggested thermal profiles for soldering processes

MELF 13"

5000

4.0

10,000

337*337*37

330

360*360*220

50,000

11.0

PACKAGE

REEL SIZE

REEL COMPONENT SPACING

BOX INNER BOX REEL DIA,CARTON SIZE CARTON APPROX.

GROSS WEIGHT

(kg)(pcs)(m/m)(m/m)(m/m)(pcs)(m/m)(pcs)

Page 7

SM5817 THRU SM5819

Formosa MS

Document ID Issued Date Revised Date Revision Page.DS-222611 2008/02/10 - A 7

MELF Schottky Barrier Rectifier

1. Solder Resistance

2. Solderability

3. High Temperature Reverse Bias

4. Forward Operation Life

5. Intermittent Operation Life

6. Pressure Cooker

7. Temperature Cycling

8. Thermal Shock

9. Forward Surge

10. Humidity

11. High T emperature Storage Life

12. Solvent Resistance

O at 260±5C for 10±2sec.

immerse body into solder 1/16"±1/32"O at 245±5C for 5 sec.

O V =80% rate at T =125C for 168 hrs.

R A O Rated average rectifier current at T=25C for 500hrs.O T = 25C, I = I A F O

On state: power on for 5 min.off state: power off for 5 min. on and off for 500 cycles.O 15P at T =121C for 4 hrs.

SIG A O O -55C to +125C dwelled for 30 min.

and transferred for 5min. total 10 cycles.

O O 0C for 5 min. rise to 100C for 5 min. total 10 cycles.

8.3ms single half sine-wave superimposed on rated load, one surge.

O at T =65C, RH=98% for 1000hrs.

A O at 175C for 1000 hrs.

O Dip into Freon at 25C for 1 min.

MIL-STD-750D METHOD-2031MIL-STD-202F METHOD-208MIL-STD-750D METHOD-1026MIL-STD-750D METHOD-1027MIL-STD-750D METHOD-1036

MIL-STD-750D METHOD-1051MIL-STD-750D METHOD-1056MIL-STD-750D METHOD-4066-2MIL-STD-750D METHOD-1038MIL-STD-750D METHOD-1031MIL-STD-202F METHOD-215

Item T est Conditions Reference

High reliability test capabilities

http://www.formosams.com/TEL:886-2-22696661FAX:886-2-22696141