l293D电机驱动资料

D Peak Output Current 2 A Per Channel (1.2 A for L293D)

D

Output Clamp Diodes for Inductive Transient Suppression (L293D)

description/ordering information

The L293 and L293D are quadruple high-current half-H drivers. The L293 is designed to provide bidirectional drive currents of up to 1 A at voltages from 4.5 V to 36 V. The L293D is designed to provide bidirectional drive currents of up to 600-mA at voltages from 4.5 V to 36 V. Both devices are designed to drive inductive loads such as relays, solenoids, dc and bipolar stepping motors, as well as other high-current/high-voltage loads in positive-supply applications.

All inputs are TTL compatible. Each output is a complete totem-pole drive circuit, with a Darlington transistor sink and a pseudo-Darlington source. Drivers are enabled in pairs, with drivers 1 and 2 enabled by 1,2EN and drivers 3 and 4enabled by 3,4EN. When an enable input is high, the associated drivers are enabled, and their outputs are active and in phase with their inputs. When the enable input is low, those drivers are disabled, and their outputs are off and in the high-impedance state. With the proper data inputs, each pair of drivers forms a full-H (or bridge)reversible drive suitable for solenoid or motor applications.

ORDERING INFORMATION

T A

PACKAGE †

ORDERABLE

PART NUMBER TOP-SIDE MARKING HSOP (DWP)

Tube of 20L293DWP L293DWP C to 70PDIP (N)Tube of 25L293N L293N 0°C to 70

°C PDIP (NE)Tube of 25L293NE L293NE PDIP (NE)

Tube of 25

L293DNE

L293DNE

†

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package.

PRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

12345671011121314

2827262524232221201918171615

1,2EN

1A 1Y NC NC NC

NC NC 2Y 2A V CC2

V CC14A 4Y NC NC NC

NC NC 3Y 3A 3,4EN

L293...DWP PACKAGE

(TOP VIEW)

HEAT SINK AND GROUND HEAT SINK AND GROUND

On the L293, external high-speed output clamp diodes should be used for inductive transient suppression.

A V CC1 terminal, separate from V CC2, is provided for the logic inputs to minimize device power dissipation.

The L293and L293D are characterized for operation from 0°C to 70°C.

block diagram

V CC2

V CC1

NOTE: Output diodes are internal in L293D.

FUNCTION TABLE

(each driver)

INPUTS†

A EN OUTPUT

Y

H H H

L H L

X L Z

H = high level, L = low level, X = irrelevant, Z = high impedance (off)

†In the thermal shutdown mode, the output is in the high-impedance state, regardless of the input levels.logic diagram

1A 1,2EN

2A

3A 3,4EN

4A 1Y 2Y 3Y 4Y

schematics of inputs and outputs (L293)

Input

V CC2

Output

GND TYPICAL OF ALL OUTPUTS

EQUIVALENT OF EACH INPUT V CC1

Current

Source

GNDschematics of inputs and outputs (L293D)

Input

V CC2

Output

GND TYPICAL OF ALL OUTPUTS

EQUIVALENT OF EACH INPUT

V CC1

Current

Source

GND

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†

Supply voltage, V CC1(see Note 1) 36 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Output supply voltage, V CC236 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input voltage, V I7 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Output voltage range, V O −3

V to

V CC2 + 3 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Peak output current, I O (nonrepetitive, t ≤ 5 ms): L293 ±2 A

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Peak output current, I O (nonrepetitive, t ≤ 100 µs): L293D ±1.2 A

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous output current, I O: L293 ±1 A

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous output current, I O: L293D ±600 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Package thermal impedance, θJA (see Notes 2 and 3):DWP package TBD°C/W

. . . . . . . . . . . . . . . . . . . . . . .

N package 67°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . .

NE package TBD°C/W

. . . . . . . . . . . . . . . . . . . . . . . . .

Maximum junction temperature, T J 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Storage temperature range, T stg −65°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES: 1.All voltage values are with respect to the network ground terminal.

2.Maximum power dissipation is a function of T J(max), q JA, and T A. The maximum allowable power dissipation at any allowable

ambient temperature is P D = (T J(max) − T A)/q JA. Operating at the absolute maximum T J of 150°C can affect reliability.

3.The package thermal impedance is calculated in accordance with JESD 51-7.recommended operating conditions

MIN MAX UNIT

Supply voltage V CC1 4.57

Supply voltage

V CC2V CC136

V

High level input voltage V CC1≤ 7 V 2.3V CC1V

V IH High-level input voltage

V CC1≥ 7 V 2.37V

V IL Low-level output voltage−0.3† 1.5V

T A Operating free-air temperature070°C

†The algebraic convention, in which the least positive (most negative) designated minimum, is used in this data sheet for logic voltage levels. electrical characteristics, V CC1 = 5 V, V CC2 = 24 V, T A = 25°C

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

V OH High-level output voltage L293: I OH = −1 A

L293D: I OH = −0.6 A

V CC2 − 1.8V CC2 − 1.4V

V OL Low-level output voltage L293: I OL= 1 A

L293D: I OL = 0.6 A

1.2 1.8V

V OKH High-level output clamp voltage L293D: I OK = −0.6 A V CC2+1.3V V OKL Low-level output clamp voltage L293D: I OK = 0.6 A 1.3V

High level input current A

7V

0.2100

I IH High-level input current

EN V I = 7 V

0.210

µA

Low level input current A

−3−10

I IL Low-level input current

EN V I = 0

−2−100

µA All outputs at high level1322

I= 0All outputs at low level3560

I CC1Logic supply current O 0

All outputs at high impedance824

mA

All outputs at high level1424

I Output supply current I = 0All outputs at low level26mA CC2p pp y O

All outputs at high impedance24 switching characteristics, V CC1 = 5 V, V CC2 = 24 V, T A = 25°C

TEST CONDITIONS L293NE, L293DNE

PARAMETER TEST CONDITIONS

MIN TYP MAX

UNIT t PLH Propagation delay time, low-to-high-level output from A input800ns

t PHL Propagation delay time, high-to-low-level output from A input

=30pF See Figure1400ns

t TLH Transition time, low-to-high-level output C L = 30 pF, See Figure 1

300ns

t THL Transition time, high-to-low-level output300ns

switching characteristics, V CC1 = 5 V, V CC2 = 24 V, T A = 25°C

L293DWP, L293N

L293DN

PARAMETER TEST CONDITIONS

MIN TYP MAX

UNIT t PLH Propagation delay time, low-to-high-level output from A input750ns

t PHL Propagation delay time, high-to-low-level output from A input

=30pF See Figure1200ns

t TLH Transition time, low-to-high-level output C L = 30 pF, See Figure 1

100ns

t THL Transition time, high-to-low-level output350nsPARAMETER MEASUREMENT INFORMATION

TEST CIRCUIT

OH VOLTAGE WAVEFORMS

OL

NOTES: A.C L includes probe and jig capacitance.

B.The pulse generator has the following characteristics: t r≤ 10 ns, t f≤ 10 ns, t w = 10 µs, PRR = 5 kHz, Z O = 50 Ω.

Figure 1. Test Circuit and Voltage Waveforms

24 V

5 V

10 k ΩV CC1

V CC2Control A

Control B

4, 5, 12, 13GND

Thermal Shutdown

Motor

16

8

3

6

11

14

4Y 3Y 2Y 1Y 1,2EN

1A 2A 3,4EN

3A 4A 15

10

9

7

2

1

Figure 2. Two-Phase Motor Driver (L293)

24 V

5 V

10 k Ω

V CC1

V CC216

8

1,2EN

1

1A 2

2A 7

3,4EN

9

3A 10

4A 15

Control A

Control B

4, 5, 12, 13GND

Thermal Shutdown

Motor

1Y 3

2Y 6

3Y 11

4Y 14

Figure 3. Two-Phase Motor Driver (L293D)

EN

3A M1

4A M2

H H Fast motor stop

H Run

H L Run

L Fast motor stop L

X

Free-running motor

stop

X

Free-running motor stop

L = low, H = high, X = don’t care

EN 1A 2A FUNCTION

H L H Turn right

H H L Turn left H L L

Fast motor stop H H H Fast motor stop L

X

X

Fast motor stop

L = low, H = high, X = don’t care

V CC2

Figure 4. DC Motor Controls (connections to ground and to

supply voltage)

GND

V CC2

V CC1

EN

Figure 5. Bidirectional DC Motor Control

GND

0.22

V CC2

D1−D8 = SES5001

Figure 6. Bipolar Stepping-Motor Control

mounting instructions

The Rthj-amp of the L293 can be reduced by soldering the GND pins to a suitable copper area of the printed circuit board or to an external heat sink.

Figure 9 shows the maximum package power P TOT and the θJA as a function of the side of two equal square copper areas having a thickness of 35 µm(see Figure 7). In addition, an external heat sink can be used (see Figure 8).

During soldering, the pin temperature must not exceed 260°C, and the soldering time must not exceed 12 seconds.

The external heatsink or printed circuit copper area must be connected to electrical ground.

Figure 7. Example of Printed Circuit Board Copper Area

(used as heat sink)

(θJA= 25°C/W)

3102

10

20

P 4

MAXIMUM POWER AND JUNCTION

vs

THERMAL RESISTANCE

30

T O T − P o w e r D i s s i p a t i o n − W

60

20

40

80

θJ A − T h e r m a l R e s i s t a n c e −°C /W

40

Side − mm

Figure 950

5

3102

−50

0504

MAXIMUM POWER DISSIPATION

vs

AMBIENT TEMPERATURE

100

T A − Ambient Temperature −

°C

Figure 10

150

P T O T − P o w e r D i s s i p a t i o n − W

www.ti.com7-Jun-2010 PACKAGING INFORMATION

Orderable Device Status (1)Package Type Package

Drawing Pins Package Qty Eco Plan (2)Lead/

Ball Finish

MSL Peak Temp (3)Samples

(Requires Login)

L293DDWP OBSOLETE SOIC DW28TBD Call TI Call TI Samples Not Available L293DDWPTR OBSOLETE SOIC DW28TBD Call TI Call TI Samples Not Available L293DN OBSOLETE PDIP N16TBD Call TI Call TI Samples Not Available L293DNE ACTIVE PDIP NE1625Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type Contact TI Distributor

or Sales Office L293DNEE4ACTIVE PDIP NE1625Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type Contact TI Distributor

or Sales Office L293DSP OBSOLETE16TBD Call TI Call TI Samples Not Available L293DSP883B OBSOLETE16TBD Call TI Call TI Samples Not Available L293DSP883C OBSOLETE UTR TBD Call TI Call TI Samples Not Available L293DWP OBSOLETE SOIC DW28TBD Call TI Call TI Replaced by L293DNE L293DWPG4OBSOLETE SOIC DW28TBD Call TI Call TI Replaced by L293DNE L293DWPTR OBSOLETE SO PowerPAD DWP28TBD Call TI Call TI Samples Not Available L293N OBSOLETE PDIP N16TBD Call TI Call TI Replaced by L293DNE L293NE ACTIVE PDIP NE1625Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type Contact TI Distributor

or Sales Office L293NEE4ACTIVE PDIP NE1625Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type Contact TI Distributor

or Sales Office L293NG4OBSOLETE PDIP N16TBD Call TI Call TI Replaced by L293DNE

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

www.ti.com7-Jun-2010 Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

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