SES5VD323-2B

Feature

500W peak pulse power per line (t P = 8/20μs) SOD-323 package

Replacement for MLV(0805) Unidirectional configurations Protects one power or I/O port ESD protection > 40 kV Low clamping voltage RoHS compliant

Transient protection for data lines to IEC 61000-4-2(ESD) ±15KV(air), ±8KV(contact); IEC 61000-4-4 (EFT) 40A (5/50ns)

IEC 61000-4-5(surge): 24A, 8/20μs-Level 2(line-groud) & Level 3(line-line)

Applications

Laptop computers Cellular phones Digital cameras

PDAs

Electrical characteristics per line@25℃(unless otherwise specified)

Absolute maximum rating @25℃

Parameter Symbol Conditions Min. Typ. Max. Units

Reverse stand-off voltage V RWM 5 V Reverse Breakdown voltage V BR I t = 1mA 6 V Reverse Leakage Current

I R V RWM = 5V T=25°C

1

μA

Clamping Voltage V C I PP = 1A t P = 8/20μs 9.8 V Clamping Voltage V C I PP =42A t P = 8/20μs 14.5 V Junction Capacitance

C j

V R =0V f = 1MHz

300

pF

Rating Symbol Value Units

Unidirectional Peak Pulse Power (t p =8/20μＳ)

P pp 500 W Operating Temperature T J -55 to +150 ℃ Storage Temperature

T STG

-55 to +150

℃

Typical Characteristics

FIGURE4

What IC?(IC Literacy)

IC, i.e. the integrated circuit is a semiconductor manufacturing process,

in a smaller silicon wafer production on a number of transistors and resistors,

capacitors and other components, and in accordance with the multilayer wiring or tunnel

wiring method of the components combined into acomplete electronic circuit.

It is in the circuit with the letters "IC" (also useful text symbol "N'', etc.).

Product dimension and pad size

Carrier size

Revision History

Revision Date

Changes

1.0 2008-7-3

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