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MIL-STD-883H change summary

来源:动视网 责编:小OO 时间:2025-09-27 21:49:30
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MIL-STD-883H change summary

DSCC-VAS4September2008MEMORANDUMFORMILITARY/INDUSTRYDISTRIBUTIONSUBJECT:InitialDraftofMIL-STD-883,RevisionH;ProjectNumber5962-2008-011TheinitialdraftforthissubjectdocumentisnowavailableforviewinganddownloadingfromtheDSCC-VAWebsite:http://www.dscc.dl
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导读DSCC-VAS4September2008MEMORANDUMFORMILITARY/INDUSTRYDISTRIBUTIONSUBJECT:InitialDraftofMIL-STD-883,RevisionH;ProjectNumber5962-2008-011TheinitialdraftforthissubjectdocumentisnowavailableforviewinganddownloadingfromtheDSCC-VAWebsite:http://www.dscc.dl


DSCC-VAS 4 September 2008

MEMORANDUM FOR MILITARY/INDUSTRY DISTRIBUTION

SUBJECT: Initial Draft of MIL-STD-883, Revision H; Project Number 5962-2008-011 The initial draft for this subject document is now available for viewing and downloading from the DSCC-VA Website:

http://www.dscc.dla.mil/Programs/MilSpec/DocSearch.asp

This document is being revised to incorporate needed changes. Highlights of the changes are described below:

1. Test Method (TM) 1014, Seal Test, has incorporated proposed Appendix A for Cumulative Helium Leak Test as an optional procedure.

2. TM 1018, Internal Gas Analysis, is replaced with an identical method to that within MIL-STD-750.

3. TM 1019, Ionization Radiation (Total Dose), has been changed to add provisions for using dry ice as a means to transport test units between the manufacturer and the test labs.

4. TM 2009, External Visual, has been changed to add failure criteria for the Ball/column grid array device.

5. TM 2011, Bond Pull, has been changed to prescribe where to place the hook, and has added a new test method for wire ball bond shear testing.

6. TM 5005, Qualification and Quality Conformance Procedures, has an added Subgroup 9 in Table IV to comply with the Soldering Heat Test Method (TM 2036).

7. TM 5007, Wafer Lot Acceptance, has several changes to Table I.

The document, on the DSCC-VA Website, has been formatted for ease in

viewing. Proposed additions have been incorporated in yellow highlighted lettering and proposed deletions have been marked in red strikeout lettering. For your convenience, both a change summary matrix and a compilation of the pages having the proposed changes to the document are also available on the DSCC-VA Website.

Concurrence or comments are required at this Center within 60 days from the date of this letter. Late comments will be held for the next coordination of the document. Comments from military departments must be identified as either "Essential" or "Suggested". Essential comments must be justified with supporting data. Military review activities should forward comments to their custodians, as applicable, and this office. Since Navy-EC is the custodian of this document, all Navy activities should forward their comments directly to this Center. Please provide sufficient time to allow for consolidating the department reply.

DEFENSE LOGISTICS AGENCY

DEFENSE SUPPLY CENTER, COLUMBUS

POST OFFICE BOX 3990 COLUMBUS, OH 43216-5000

IN REPLY REFER TO

\\Signed\

Robert M. Heber

Chief

Team

Microelectronics

cc:

VQ

VSS

2

文档

MIL-STD-883H change summary

DSCC-VAS4September2008MEMORANDUMFORMILITARY/INDUSTRYDISTRIBUTIONSUBJECT:InitialDraftofMIL-STD-883,RevisionH;ProjectNumber5962-2008-011TheinitialdraftforthissubjectdocumentisnowavailableforviewinganddownloadingfromtheDSCC-VAWebsite:http://www.dscc.dl
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