ps2501

PHOTOCOUPLER

PS2501-1,-4,PS2501L-1,-4

HIGH ISOLATION VOLTAGE SINGLE TRANSISTOR TYPE MULTI PHOTOCOUPLER SERIES

−NEPOC Series −

Document No. PN10225EJ04V0DS (4th edition) Date Published August 2009 NS

1988, 2009

The mark shows major revised points.

The revised points can be easily searched by copying an "" in the PDF file and specifying it in the "Find what:" field.

PS2501-1, PS2501L-1

1. Anode

2. Cathode

3. Emitter

4. Collector

1

2

4

3

PS2501-4, PS2501L-4

1

2345678

161514131211109

1, 3, 5, 7. Anode 2, 4, 6, 8. Cathode 9, 11, 13, 15. Emitter 10, 12, 14, 16. Collector

(Top View)

PIN CONNECTION

DESCRIPTION

The PS2501-1, -4 and PS2501L-1, -4 are optically coupled isolators containing a GaAs light emitting diode and an NPN silicon phototransistor.

The PS2501-1, -4 are in a plastic DIP (Dual In-line Package) and the PS2501L-1, -4 are lead bending type (Gull-wing) for surface mount.

FEATURES

• High isolation voltage (BV = 5 000 Vr.m.s.) • High collector to emitter voltage (V CEO = 80 V) • High-speed switching (t r = 3 µs TYP., t f = 5 µs TYP.)

• Ordering number of tape product: PS2501L-1-F3: 2 000 pcs/reel • Safety standards • UL approved: No. E72422

APPLICATIONS

• Power supply • Telephone/FAX. • FA/OA equipment

• Programmable logic controller

Data Sheet PN10225EJ04V0DS

2

PACKAGE DIMENSIONS (UNIT : mm)

DIP Type

PS2501-4

PS2501-1

19.8±0.5

6.5±0.5

3.5±0.3

4.15±0.4

3.2±0.4 2.54

1.25±0.15

0.50±0.100.25 M

0 to 15°7.62

0.25+0.1

–0.05

3.5±0.3

4.15±0.4

3.2±0.4 2.54

1.25±0.15

0.50±0.100.25 M

4.6±0.35

6.5±0.5

0 to 15°7.62

0.25+0.1

–0.05

Lead Bending Type

PS2501L-4

PS2501L-1

0.25 M

4.6±0.35

6.5±0.5

3.5±0.3

2.54

1.25±0.150.15

0.9±0.25

9.60±0.4

0.25+0.1

–0.05

0.1+0.1

–0.05

19.8±0.5

6.5±0.5

2.54

1.25±0.150.25 M

3.5±0.3

0.15

0.9±0.259.60±0.4

0.25+0.1

–0.05

0.1+0.1 –0.05

PHOTOCOUPLER CONSTRUCTION

Parameter Unit (MIN.)

Air Distance

7 mm Outer Creepage Distance 7 mm Inner Creepage Distance 3.5 mm Isolation Distance

0.3 mm

Data Sheet PN10225EJ04V0DS

3

MARKING EXAMPLE

2501MJ931

PS2501-4NJ931

J

PS2501-1

PS2501-4

Assembly Lot

Week Assembled Year Assembled (Last 1 Digit)In-house Code CTR Rank Code No. 1 pin Mark

Package New PKG

Made in Japan

Made in Taiwan

No. 1 pin Mark

N J

Week Assembled Year Assembled (Last 1 Digit)In-house Code CTR Rank Code

Package New PKG

Made in Japan

931

M 931Country Assembled Type Number Assembly Lot

J J K

Data Sheet PN10225EJ04V0DS

4

ORDERING INFORMATION

Part Number

Order Number

Solder Plating Specification

Packing Style

Safety Standard

Approval Application Part Number *1

PS2501-1

PS2501-1-A

Pb-Free

Magazine case 100 pcs Standard products

PS2501-1

PS2501L-1 PS2501L-1-A

(UL approved) PS2501L-1-F3 PS2501L-1-F3-A Embossed Tape 2 000 pcs/reel

PS2501-4

PS2501-4-A

Magazine case 20 pcs PS2501-4 PS2501L-4 PS2501L-4-A

*1 For the application of the Safety Standard, following part number should be used.

Data Sheet PN10225EJ04V0DS

5

ABSOLUTE MAXIMUM RATINGS (Unless otherwise specified, T A = 25°C)

Ratings Parameter Symbol PS2501-1, PS2501L-1

PS2501-4,

PS2501L-4

Unit

Diode Reverse Voltage V R 6 V Forward Current (DC) I F 80 mA/ch

Power Dissipation Derating

∆P D /°C 1.5 1.2 mW/°C

Power Dissipation P D 150 120 mW/ch

Peak Forward Current *1

I FP 1 A/ch Transistor Collector to Emitter Voltage V CEO 80 V

Emitter to Collector Voltage

V ECO 7 V Collector Current I C 50 mA/ch

Power Dissipation Derating

∆P C /°C 1.5 1.2 mW/°C

Power Dissipation P C 150

120 mW/ch

Isolation Voltage *2

BV 5 000 Vr.m.s. Operating Ambient Temperature T A −55 to +100 °C Storage Temperature

T stg

−55 to +150

°C

*1 PW = 100 µs, Duty Cycle = 1%

*2 AC voltage for 1 minute at T A = 25°C, RH = 60% between input and output. Pins 1-2 shorted together, 3-4 shorted together (PS2501-1, PS2501L-1). Pins 1-8 shorted together, 9-16 shorted together (PS2501-4, PS2501L-4).

Data Sheet PN10225EJ04V0DS

6

ELECTRICAL CHARACTERISTICS (T A = 25°C)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

Diode Forward Voltage

V F

I F = 10 mA 1.17 1.4 V

Reverse Current I R V R = 5 V

5 µA Terminal Capacitance C t V = 0 V, f = 1.0 MHz 50 pF Transistor Collector to Emitter Dark

Current

I CEO

V CE = 80 V, I F = 0 mA

100

nA

Coupled Current Transfer Ratio (I C /I F )*1

CTR I F = 5 mA, V CE = 5 V

80 300 600 %

Collector Saturation Voltage

V CE (sat)

I F = 10 mA, I C = 2 mA

0.3 V

Isolation Resistance R I-O V I-O = 1.0 kV DC 1011

Ω Isolation Capacitance C I-O V = 0 V, f = 1.0 MHz

0.5

pF

Rise Time *2

t r V CC = 10 V, I C = 2 mA, R L = 100 Ω 3 µs

Fall Time *2

t f

5

*1 CTR rank ( * : only PS2501-1, PS2501L-1) K* : 300 to 600 (%) L* : 200 to 400 (%) M* : 80 to 240 (%) D* : 100 to 300 (%) H* : 80 to 160 (%) W* : 130 to 260 (%) Q* : 100 to 200 (%)

N : 80 to 600 (%)

*2 Test circuit for switching time

PW = 100 s

Duty Cycle = 1/10

µPulse Input

V CC

OUT

R L = 100 Ω

50 Ω

I

TYPICAL CHARACTERISTICS (Unless otherwise specified, T A = 25°C)

1.5 mW/°C

1.2 mW/°C

V CE = 80 V

10 m A

1.5 mW/°C

1.2 mW/°C

20 m A 50 m A 2 m A

I F = 1 mA

5 m A 40 V 24 V 10 V 5 V

PS2501-1PS2501L-1

PS2501-4PS2501L-4

PS2501-1PS2501L-1

PS2501-4PS2501L-4

1+60°C +25°C

T A = +100°C

D i o d e P o w e r D i s s i p a t i o n P D (m W )

T r a n s i s t o r P o w e r D i s s i p a t i o n P C (m W )

Ambient Temperature T A (°C)

F o r w a r d C u r r e n t I F (m A )

Forward Voltage V F (V)C o l l e c t o r t o E m i t t e r D a r k C u r r e n t I C E O (n A )

Collector Saturation Voltage V CE (sat) (V)

Ambient Temperature T A (°C)Ambient Temperature T A (°C)DIODE POWER DISSIPATION vs.AMBIENT TEMPERATURE TRANSISTOR POWER DISSIPATION vs. AMBIENT TEMPERATURE

FORWARD CURRENT vs.FORWARD VOLTAGE

COLLECTOR TO EMITTER DARK

CURRENT vs. AMBIENT TEMPERATURE

COLLECTOR CURRENT vs.

COLLECTOR SATURATION VOLTAGE

C o l l e c t o r C u r r e n t I C (m A )

20 m A I F = 5 mA

10

m A 50

m

A C o l l e c t o r C u r r e n t I C (m A )

Collector to Emitter Voltage V CE (V)

COLLECTOR CURRENT vs.

COLLECTOR TO EMITTER VOLTAGE

0°C –25°C –50°C

Remark The graphs indicate nominal characteristics.

1.2–50

1.00.80.60.40.20

–25

25

50

75

100

50

10

1

0.1100 k

50 k 10 k

5 k 1 k

500100

I C = 2 mA,V CC = 10 V,CTR = 290%

t f t r

t d

t s

I F = 5 mA,V CC = 5 V,CTR = 290%

t s

t d

t r

t f

I F = 5 mA,V CE = 5 V

100 Ω

300 Ω

R L = 1 k Ω

Normalized to 1.0at T A = 25°C,

I F = 5 mA, V CE = 5 V

Forward Current I F (mA)

Ambient Temperature T A (°C)Load Resistance R L (Ω)Frequency f (kHz)

N o r m a l i z e d C u r r e n t T r a n s f e r R a t i o C T R

C u r r e n t T r a n s f e r R a t i o C T R (%)

N o r m a l i z e d G a i n G V

Load Resistance R L (Ω)

S w i t c h i n g T i m e t ( s )

µNORMALIZED CURRENT TRANSFER RATIO vs. AMBIENT TEMPERATURE

CURRENT TRANSFER RATIO vs.FORWARD CURRENT

SWITCHING TIME vs.LOAD RESISTANCE

SWITCHING TIME vs.

LOAD RESISTANCE

FREQUENCY RESPONSE

S w i t c h i n g T i m e t ( s )

µ2502001500

0.050.1

0.5

1

5

1050

T A = 25°C

T A = 60°C

101010Time (Hr)

C T R (R e l a t i v e V a l u e )

LONG TERM CTR DEGRADATION

I F = 5 mA

Sample A

B C D

V CE = 5 V

Remark The graphs indicate nominal characteristics.

TAPING SPECIFICATIONS (UNIT : mm)

Tape Direction

Outline and Dimensions (Tape)

Outline and Dimensions (Reel)

PS2501L-1-F3

1.55±0.1

2.0±0.14.0±0.1

1.75±0.1

4.5 MAX.

4.0±0.10.4

5.3±0.1

8.0±0.1

7.5±0.1

16.0±0.3

10.3±0.1

1.5+0.1–0

φPacking: 2 000 pcs/reel

2.0±0.5

R 1.0

13.0±0.2

φ21.0±0.8

φ330±2.0

100±1.0

2.0±0.5

φφ15.9 to 19.4Outer edge of flange

21.5±1.0

17.5±1.0

NOTES ON HANDLING

1. Recommended soldering conditions

(1) Infrared reflow soldering • Peak reflow temperature 260°C or below (package surface temperature) • Time of peak reflow temperature 10 seconds or less • Time of temperature higher than 220°C 60 seconds or less • Time to preheat temperature from 120 to 180°C 120±30 s

• Number of reflows Three

• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.)

120±30 s (preheating)

220°C

180°C

P a c k a g e S u r f a c e T e m p e r a t u r e T (°C )

Time (s)

Recommended Temperature Profile of Infrared Reflow

(heating)to 10 s

to 60 s

260°C MAX.120°C

(2) Wave soldering • Temperature 260°C or below (molten solder temperature) • Time

10 seconds or less

• Preheating conditions 120°C or below (package surface temperature)

• Number of times One (Allowed to be dipped in solder including plastic mold portion.)

• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.)

(3) Soldering by soldering iron

• Peak temperature (lead part temperature) 350°C or below • Time (each pins)

3 seconds or less

• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.)

(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead. (b) Please be sure that the temperature of the package would not be heated over 100°C.

(4) Cautions

• Fluxes

Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.

2. Cautions regarding noise

Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum ratings.

3. Measurement conditions of current transfer ratios (CTR), which differ according to photocoupler

Check the setting values before use, since the forward current conditions at CTR measurement differ according to product.

When using products other than at the specified forward current, the characteristics curves may differ from the standard curves due to CTR value variations or the like. This tendency may sometimes be obvious, especially below

I F = 1 mA.

Therefore, check the characteristics under the actual operating conditions and thoroughly take variations or the like into consideration before use.

USAGE CAUTIONS

1.Protect against static electricity when handling.

2.Avoid storage at a high temperature and high humidity.

The information in this document is current as of August, 2009. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information.

No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document.

NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.

Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information.

While NEC Electronics endeavors to enhance the quality and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. In addition, NEC Electronics products are not taken measures to prevent radioactive rays in the product design. When customers use NEC Electronics products with their products, customers shall, on their own responsibility, incorporate sufficient safety measures such as redundancy, fire-containment and anti-failure features to their products in order to avoid risks of the damages to property (including public or social property) or injury (including death) to persons, as the result of defects of NEC Electronics products.

NEC Electronics products are classified into the following three quality grades: "Standard

The "Specific" quality grade applies only to NEC Electronics products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application.

The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application.

(Note)

••••••M8E0904E

(1)(2)"NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its

majority-owned subsidiaries.

"NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as

defined above).

Computers, office equipment, communications equipment, test and measurement equipment, audio

and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots.

Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster

systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support).

Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life

support systems and medical equipment for life support, etc."Standard":"Special":"Specific":

PS2501-1,-4,PS2501L-1,-4

Caution GaAs Products This product uses gallium arsenide (GaAs).

GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe

the following points.

• Follow related laws and ordinances when disposing of the product. If there are no applicable laws

and/or ordinances, dispose of the product as recommended below.

1. Commission a disposal company able to (with a license to) collect, transport and dispose of

materials that contain arsenic and other such industrial waste materials.

2. Exclude the product from general industrial waste and household garbage, and ensure that the

product is controlled (as industrial waste subject to special control) up until final disposal.

• Do not burn, destroy, cut, crush, or chemically dissolve the product.

• Do not lick the product or in any way allow it to enter the mouth.