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PS2501-1资料

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PS2501-1资料

Toourcustomers,OldCompanyNameinCatalogsandOtherDocumentsOnApril1st,2010,NECElectronicsCorporationmergedwithRenesasTechnologyCorporation,andRenesasElectronicsCorporationtookoverallthebusinessofbothcompanies.Therefore,althoughtheoldcompanynameremainsi
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导读Toourcustomers,OldCompanyNameinCatalogsandOtherDocumentsOnApril1st,2010,NECElectronicsCorporationmergedwithRenesasTechnologyCorporation,andRenesasElectronicsCorporationtookoverallthebusinessofbothcompanies.Therefore,althoughtheoldcompanynameremainsi
To our customers,

Old Company Name in Catalogs and Other Documents

On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding.

Renesas Electronics website: http://www.renesas.com

April 1st, 2010

Renesas Electronics Corporation

Issued by: Renesas Electronics Corporation (http://www.renesas.com)

Send any inquiries to http://www.renesas.com/inquiry.Notice

1. All information included in this document is current as of the date this document is issued. Such information, however, is

subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website.

2. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights

of third parties by or arising from the use of Renesas Electronics products or technical information described in this document.

No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others.

3. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part.

4. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of

semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information.

5. When exporting the products or technology described in this document, you should comply with the applicable export control

laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas

Electronics products or the technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations.

6. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics

does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein.

7. Renesas Electronics products are classified according to the following three quality grades: “Standard”, “High Quality”, and

“Specific”. The recommended applications for each Renesas Electronics product depends on the product’s quality grade, as indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular

application. You may not use any Renesas Electronics product for any application categorized as “Specific” without the prior written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an application categorized as “Specific” or for which the product is not intended where you have failed to obtain the prior written consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise

expressly specified in a Renesas Electronics data sheets or data books, etc.

“Standard”: Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots.

“High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-crime systems; safety equipment; and medical equipment not specifically designed for life support.

“Specific”: Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare

intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life.

8. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics,

especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the use of Renesas Electronics products beyond such specified ranges.

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specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a

Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you.

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compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations.

11. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas

Electronics.

12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this

document or Renesas Electronics products, or if you have any other inquiries.

(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majority-owned subsidiaries.

(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.

1988, 2010

DATA SHEET

The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.

Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information.

Document No. PN10225EJ05V0DS (5th edition)

Date Published February 2010 NS Printed in Japan

The mark shows major revised points.

The revised points can be easily searched by copying an "" in the PDF file and specifying it in the "Find what:" field.

DESCRIPTION

The PS2501-1, -4 and PS2501L-1, -4 are optically coupled isolators containing a GaAs light emitting diode and an

NPN silicon phototransistor. The PS2501-1, -4 are in a plastic DIP (Dual In-line Package) and the PS2501L-1, -4 are lead bending type (Gull-wing) for surface mount.

FEATURES

• High isolation voltage (BV = 5 000 Vr.m.s.) • High collector to emitter voltage (V CEO = 80 V) • High-speed switching (t r = 3 μs TYP., t f = 5 μs TYP.)

• Ordering number of tape product: PS2501L-1-F3: 2 000 pcs/reel • Safety standards • UL approved: No. E72422

APPLICATIONS

• Power supply • Telephone/AX. • A/OA equipment

• Programmable logic controller

Data Sheet PN10225EJ05V0DS

2

PACKAGE DIMENSIONS (UNIT : mm)

DIP Type

Lead Bending Type

PHOTOCOUPLER CONSTRUCTION

Parameter Unit (MIN.)

Air Distance

7 mm Outer Creepage Distance 7 mm Inner Creepage Distance 3.5 mm Isolation Distance

0.3 mm

Data Sheet PN10225EJ05V0DS

3

MARKING EXAMPLE

Data Sheet PN10225EJ05V0DS

4

ORDERING INFORMATION

Part Number

Order Number

Solder Plating Specification

Packing Style

Safety Standard

Approval Application Part Number *1

PS2501-1 PS2501-1-A Pb-F

ree Magazine case 100 pcs Standard products

PS2501-1

PS2501L-1 PS2501L-1-A

(UL approved) PS2501L-1-F3 PS2501L-1-F3-A Embossed Tape 2 000 pcs/reel

PS2501-4

PS2501-4-A

Magazine case 20 pcs PS2501-4 PS2501L-4 PS2501L-4-A

PS2501-1 PS2501-1Y-A Special version Magazine case 100 pcs Standard products

PS2501-1

PS2501L-1 PS2501L-1Y-A (Pb-F

ree and (UL approved) PS2501L-1-F 3 PS2501L-1Y-F

3-A Halogen Free)

Embossed Tape 2 000 pcs/reel

*1 For the application of the Safety Standard, following part number should be used.

ABSOLUTE MAXIMUM RATINGS (Unless otherwise specified, T A = 25°C)

Ratings

Parameter Symbol PS2501-1, PS2501L-1

PS2501-4,

PS2501L-4

Unit

Diode Reverse Voltage V R 6 V Forward Current (DC) I F 80 mA/ch

Power Dissipation Derating

ΔP D /°C 1.5 1.2 mW/°C

Power Dissipation P D 150 120 mW/ch

Peak Forward Current *1

I FP 1 A/ch Transistor Collector to Emitter Voltage V CEO 80 V

Emitter to Collector Voltage

V ECO 7 V Collector Current I C 50 mA/ch

Power Dissipation Derating

ΔP C /°C 1.5 1.2 mW/°C

Power Dissipation P C 150

120 mW/ch

Isolation Voltage *2

BV 5 000 Vr.m.s. Operating Ambient Temperature T A −55 to +100 °C Storage Temperature

T stg

−55 to +150

°C

*1 PW = 100 μs, Duty Cycle = 1%

*2 AC voltage for 1 minute at T A = 25°C, RH = 60% between input and output. Pins 1-2 shorted together, 3-4 shorted together (PS2501-1, PS2501L-1). Pins 1-8 shorted together, 9-16 shorted together (PS2501-4, PS2501L-4).

ELECTRICAL CHARACTERISTICS (T A = 25°C)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

Diode F

orward Voltage

V F

I F = 10 mA 1.17 1.4 V

Reverse Current I R V R = 5 V

5 μ

A

Terminal Capacitance C t V = 0 V, f = 1.0 MHz 50

pF Transistor Collector to Emitter Dark

Current

I CEO

V CE = 80 V, I F = 0 mA

100

nA

Coupled

Current Transfer Ratio (I C /I F )*1

CTR I F = 5 mA, V CE = 5 V 80 300 600 %

Collector Saturation Voltage

V CE (sat)

I F = 10 mA, I C = 2 mA

0.3 V

Isolation Resistance R I-O V I-O = 1.0 kV DC 1011

Ω Isolation Capacitance C I-O V = 0 V, f = 1.0 MHz

0.5

pF

Rise Time *2

t r V CC = 10 V, I C = 2 mA, R L = 100 Ω 3 μs

F

all Time *2

t f

5

*1 CTR rank ( * : only PS2501-1, PS2501L-1) K* : 300 to 600 (%) L* : 200 to 400 (%) M* : 80 to 240 (%) D* : 100 to 300 (%) H* : 80 to 160 (%) W* : 130 to 260 (%) Q* : 100 to 200 (%)

N : 80 to 600 (%)

*2 Test circuit for switching time

V CC

OUT

Ω

Input

Output

TYPICAL CHARACTERISTICS (Unless otherwise specified, T A = 25°C)

150100

50

0255075

125150

150

50

2550100125150

D i o d e P o w e r D i s s i p a t i o n P D (m W )

T r a n s i s t o r P o w e r D i s s i p a t i o n P C (m W )

Ambient Temperature T A (°C)

F o r w a r d C u r r e n t I F (m A )

Forward Voltage V F (V)C o l l e c t o r t o

E m i t t e r D a r k C u r r e n t I C E O (n A )

Collector Saturation Voltage V CE (sat) (V)

Ambient Temperature T A (°C)Ambient Temperature T A (°C)DIODE POWER DISSIPATION vs.AMBIENT TEMPERATURE TRANSISTOR POWER DISSIPATION vs. AMBIENT TEMPERATURE

FORWARD CURRENT vs.FORWARD VOLTAGE

COLLECTOR TO EMITTER DARK

CURRENT vs. AMBIENT TEMPERATURE

COLLECTOR CURRENT vs.

COLLECTOR SATURATION VOLTAGE

C o l l e c t o r C u r r e n t I C (m A )

26C o l l e c t o r C u r r e n t I C (m A )

Collector to Emitter Voltage V CE (V)

COLLECTOR CURRENT vs.

COLLECTOR TO EMITTER VOLTAGE

Remark The graphs indicate nominal characteristics.

Load Resistance R L (Ω)Frequency f (kHz)

N o r m a l i z e d C u r r e n t T r a n s f e r R a t i o C T R

C u r r e n t T r a n s f e r R a t i o C T R (%)

N o r m a l i z e d G a i n G V

S w i t c h i n g T i m e t ( s )

μNORMALIZED CURRENT TRANSFER RATIO vs. AMBIENT TEMPERATURE

CURRENT TRANSFER RATIO vs.FORWARD CURRENT

FREQUENCY RESPONSE

S w i t c h i n g T i m e t ( s )

μ400350300250200150100500

101010Time (Hr)

C T R (R e l a t i v e V a l u e )

Remark The graphs indicate nominal characteristics.

TAPING SPECIFICATIONS (UNIT : mm)

NOTES ON HANDLING

1. Recommended soldering conditions

(1) Infrared reflow soldering • Peak reflow temperature 260°C or below (package surface temperature) • Time of peak reflow temperature 10 seconds or less • Time of temperature higher than 220°C 60 seconds or less • Time to preheat temperature from 120 to 180°C 120±30 s

• Number of reflows Three

• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.)

P a c k a g e S u r f a c e T e m p e r a t u r e T (°C )

Time (s)

Recommended Temperature Profile of Infrared Reflow

(2) Wave soldering • Temperature 260°C or below (molten solder temperature) • Time

10 seconds or less

• Preheating conditions 120°C or below (package surface temperature)

• Number of times One (Allowed to be dipped in solder including plastic mold portion.)

• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.)

(3) Soldering by soldering iron

• Peak temperature (lead part temperature) 350°C or below • Time (each pins)

3 seconds or less

• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.)

(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead. (b) Please be sure that the temperature of the package would not be heated over 100°C.

(4) Cautions

• Fluxes

Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.

2. Cautions regarding noise

Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum ratings.

3. Measurement conditions of current transfer ratios (CTR), which differ according to photocoupler

Check the setting values before use, since the forward current conditions at CTR measurement differ according to product.

When using products other than at the specified forward current, the characteristics curves may differ from the standard curves due to CTR value variations or the like. This tendency may sometimes be obvious, especially below I F = 1 mA.

Therefore, check the characteristics under the actual operating conditions and thoroughly take variations or the like into consideration before use.

USAGE CAUTIONS

1.Protect against static electricity when handling.

2.Avoid storage at a high temperature and high humidity.

Data Sheet PN10225EJ05V0DS 11

Data Sheet PN10225EJ05V0DS

12

The information in this document is current as of February, 2010. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information.

No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document.

NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.

Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information.

While NEC Electronics endeavors to enhance the quality and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. In addition, NEC Electronics products are not taken measures to prevent radioactive rays in the product design. When customers use NEC Electronics products with their products, customers shall, on their own responsibility, incorporate sufficient safety measures such as redundancy, fire-containment and anti-failure features to their products in order to avoid risks of the damages to property (including public or social property) or injury (including death) to persons, as the result of defects of NEC Electronics products.

NEC Electronics products are classified into the following three quality grades: "Standard

The "Specific" quality grade applies only to NEC Electronics products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application.

The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application.

(Note)

••••••M8E0904E (1)(2)"NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its

majority-owned subsidiaries.

"NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as

defined above).

Computers, office equipment, communications equipment, test and measurement equipment, audio

and visual equipment, home electronic appliances, machine tools, personal electronic equipment

and industrial robots.

Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster

systems, anti-crime systems, safety equipment and medical equipment (not specifically designed

for life support).

Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life

support systems and medical equipment for life support, etc.

"Standard":"Special":"Specific":

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PS2501-1资料

Toourcustomers,OldCompanyNameinCatalogsandOtherDocumentsOnApril1st,2010,NECElectronicsCorporationmergedwithRenesasTechnologyCorporation,andRenesasElectronicsCorporationtookoverallthebusinessofbothcompanies.Therefore,althoughtheoldcompanynameremainsi
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